Part Details for XC3S1200E-4FTG256C by AMD Xilinx
Results Overview of XC3S1200E-4FTG256C by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (4 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (8 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
XC3S1200E-4FTG256C Information
XC3S1200E-4FTG256C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S1200E-4FTG256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 5 |
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RFQ | ||
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Rochester Electronics | XC3S1200E - 1200K Gates, Spartan-3E FPGA RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 12525 |
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$105.7500 / $120.1700 | Buy Now |
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Win Source Electronics | FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm Technology 1.2V 256-Pin FTBGA Tray / IC FPGA 190 I/O 256FTBGA | 1000 |
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$169.1832 / $195.2113 | Buy Now |
US Tariff Estimator: XC3S1200E-4FTG256C by AMD Xilinx
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XC3S1200E-4FTG256C
XC3S1200E-4FTG256C Part Data Attributes
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XC3S1200E-4FTG256C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC3S1200E-4FTG256C
AMD Xilinx
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FTBGA-256
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Clock Frequency-Max | 572 MHz | |
| Combinatorial Delay of a CLB-Max | 0.76 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 2168 | |
| Number of Equivalent Gates | 1200000 | |
| Number of Inputs | 190 | |
| Number of Logic Cells | 19512 | |
| Number of Outputs | 150 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 2168 CLBS, 1200000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for XC3S1200E-4FTG256C
This table gives cross-reference parts and alternative options found for XC3S1200E-4FTG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S1200E-4FTG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S1200E-4FTG256IS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 19512-Cell, CMOS, PBGA256, | XC3S1200E-4FTG256C vs XC3S1200E-4FTG256IS1 |
| XC3S1200E-4FTG256CS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 19512-Cell, CMOS, PBGA256, | XC3S1200E-4FTG256C vs XC3S1200E-4FTG256CS1 |
| XC3S1200E-4FT256IS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 19512-Cell, CMOS, PBGA256, | XC3S1200E-4FTG256C vs XC3S1200E-4FT256IS1 |
| XC3S1200E-4FT256CS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 19512-Cell, CMOS, PBGA256, | XC3S1200E-4FTG256C vs XC3S1200E-4FT256CS1 |
XC3S1200E-4FTG256C Frequently Asked Questions (FAQ)
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The maximum operating temperature range for XC3S1200E-4FTG256C is -40°C to 100°C.
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You can implement a reliable POR circuit using an external resistor-capacitor (RC) network or a dedicated POR IC, ensuring a minimum pulse width of 10 ms to guarantee a clean reset.
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The recommended clocking scheme for XC3S1200E-4FTG256C is to use a single, high-frequency clock (e.g., 100 MHz) and then divide it down to generate lower-frequency clocks as needed.
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To optimize power consumption, use the Xilinx Power Analyzer tool to identify power-hungry components, reduce clock frequencies, and implement power-gating techniques.
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The maximum current draw for XC3S1200E-4FTG256C is approximately 1.5 A for the core voltage (VCCINT) and 0.5 A for the I/O voltage (VCCO).