Part Details for XC3S400-4FGG456C by AMD Xilinx
Results Overview of XC3S400-4FGG456C by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (5 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
XC3S400-4FGG456C Information
XC3S400-4FGG456C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S400-4FGG456C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 458 |
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RFQ |
US Tariff Estimator: XC3S400-4FGG456C by AMD Xilinx
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XC3S400-4FGG456C
XC3S400-4FGG456C Part Data Attributes
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XC3S400-4FGG456C
AMD Xilinx
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Datasheet
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XC3S400-4FGG456C
AMD Xilinx
Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456, 23 X 23 MM, LEAD FREE, FBGA-456
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Part Package Code | BGA | |
| Package Description | Bga, Bga456,22x22,40 | |
| Pin Count | 456 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 32 Weeks | |
| Clock Frequency-Max | 630 Mhz | |
| Combinatorial Delay of a CLB-Max | 0.61 Ns | |
| JESD-30 Code | S-PBGA-B456 | |
| JESD-609 Code | e1 | |
| Length | 23 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 896 | |
| Number of Equivalent Gates | 400000 | |
| Number of Inputs | 264 | |
| Number of Logic Cells | 8064 | |
| Number of Outputs | 264 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 896 Clbs, 400000 Gates | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 Mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Other | |
| Terminal Finish | Tin Silver Copper | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 Mm |
Alternate Parts for XC3S400-4FGG456C
This table gives cross-reference parts and alternative options found for XC3S400-4FGG456C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S400-4FGG456C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S400-4FG456C | AMD Xilinx | $10.1789 | Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456, 23 X 23 MM, FBGA-456 | XC3S400-4FGG456C vs XC3S400-4FG456C |
| XC3S400-4FG456I | AMD | Check for Price | Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456, 23 X 23 MM, FBGA-456 | XC3S400-4FGG456C vs XC3S400-4FG456I |
| XC3S400-4FGG456I | AMD | Check for Price | Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456, 23 X 23 MM, LEAD FREE, FBGA-456 | XC3S400-4FGG456C vs XC3S400-4FGG456I |
| XC3S400-4FGG456I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456, 23 X 23 MM, LEAD FREE, FBGA-456 | XC3S400-4FGG456C vs XC3S400-4FGG456I |
| XC3S400-4FGG456C | AMD | Check for Price | Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456, 23 X 23 MM, LEAD FREE, FBGA-456 | XC3S400-4FGG456C vs XC3S400-4FGG456C |
XC3S400-4FGG456C Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC3S400-4FGG456C is 350 MHz.
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The XC3S400-4FGG456C has 456 user I/O pins available.
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The typical power consumption of the XC3S400-4FGG456C is around 1.5W, but it can vary depending on the design and operating conditions.
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Yes, the XC3S400-4FGG456C supports partial reconfiguration, which allows for dynamic reconfiguration of the FPGA during runtime.
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The XC3S400-4FGG456C has a maximum of 360 Kb of block RAM available.