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XC6SLX25-2FTG256C by: AMD Xilinx

Overview of: XC6SLX25-2FTG256C by AMD Xilinx

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Price & Stock for: XC6SLX25-2FTG256C

Distributor Stock MOQ Package QTY Break / Prices
View this part on Newark 0 1 Bulk
  • 1 $52.8500
View this part on element14 Asia-Pacific 0 1 Each
  • 1 $78.6900
View this part on Farnell 0 1 Each
  • 1 $55.5800
View this part on LCSC 6 1
  • 1 $334.6363
  • 3 $334.6363
  • 5 $334.6363
  • 30 $321.3912
  • 34 $321.3912
  • 36 $321.3912
View this part on MacroQuest Electronics 2,000 10
  • 10 $247.6000
  • 100 $228.6000

Purchasing Insights: XC6SLX25-2FTG256C

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Estimated Price History

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Market Price Analysis

No data available

Distributors with Stock

Total Inventory

6,996

Part Details for: XC6SLX25-2FTG256C

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Part Details

Parametric Data

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: XC6SLX25-2FTG256C

Part Number Description Manufacturer Compare
XC6SLX25-2FT256C Programmable Logic Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 AMD Xilinx XC6SLX25-2FTG256C vs XC6SLX25-2FT256C
Part Number Description Manufacturer Compare
XA6SLX25-2FTG256I Programmable Logic Field Programmable Gate Array, 62.5MHz, 24051-Cell, PBGA256, AMD Xilinx XC6SLX25-2FTG256C vs XA6SLX25-2FTG256I
XA6SLX25-3FT256I Programmable Logic Field Programmable Gate Array, 862MHz, 24051-Cell, CMOS, PBGA256, AMD Xilinx XC6SLX25-2FTG256C vs XA6SLX25-3FT256I
XC6SLX25-3FT256I Programmable Logic Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 AMD Xilinx XC6SLX25-2FTG256C vs XC6SLX25-3FT256I
XC6SLX25-3FT256C Programmable Logic Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 AMD Xilinx XC6SLX25-2FTG256C vs XC6SLX25-3FT256C
XC6SLX25-2FT256C Programmable Logic Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 AMD Xilinx XC6SLX25-2FTG256C vs XC6SLX25-2FT256C
XC6SLX25-3FTG256I Programmable Logic Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 AMD Xilinx XC6SLX25-2FTG256C vs XC6SLX25-3FTG256I
XC6SLX25-3FTG256C Programmable Logic Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 AMD Xilinx XC6SLX25-2FTG256C vs XC6SLX25-3FTG256C
XA6SLX25-2FT256I Programmable Logic Field Programmable Gate Array, 667MHz, 24051-Cell, CMOS, PBGA256, AMD Xilinx XC6SLX25-2FTG256C vs XA6SLX25-2FT256I

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