Part Details for XC6SLX75-2CSG484C by AMD Xilinx
Results Overview of XC6SLX75-2CSG484C by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
XC6SLX75-2CSG484C Information
XC6SLX75-2CSG484C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX75-2CSG484C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 25 |
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RFQ |
US Tariff Estimator: XC6SLX75-2CSG484C by AMD Xilinx
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XC6SLX75-2CSG484C
XC6SLX75-2CSG484C Part Data Attributes
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XC6SLX75-2CSG484C
AMD Xilinx
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Datasheet
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XC6SLX75-2CSG484C
AMD Xilinx
Field Programmable Gate Array, 5831 CLBs, 667MHz, 74637-Cell, CMOS, PBGA484, 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Part Package Code | BGA | |
| Package Description | Fbga, Bga484,22x22,32 | |
| Pin Count | 484 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 667 Mhz | |
| Combinatorial Delay of a CLB-Max | 0.26 Ns | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 19 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 5831 | |
| Number of Inputs | 310 | |
| Number of Logic Cells | 74637 | |
| Number of Outputs | 310 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 5831 Clbs | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | Square | |
| Package Style | Grid Array, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.8 Mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Other | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5ag3.0cu0.5) | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.8 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 Mm |
Alternate Parts for XC6SLX75-2CSG484C
This table gives cross-reference parts and alternative options found for XC6SLX75-2CSG484C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX75-2CSG484C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC6SLX75-2CSG484I | AMD | Check for Price | Field Programmable Gate Array, 5831 CLBs, 667MHz, 74637-Cell, CMOS, PBGA484, 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484 | XC6SLX75-2CSG484C vs XC6SLX75-2CSG484I |
XC6SLX75-2CSG484C Frequently Asked Questions (FAQ)
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The maximum power consumption of XC6SLX75-2CSG484C is approximately 1.5W, but it can vary depending on the specific application and usage.
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To implement a DDR3 memory interface with XC6SLX75-2CSG484C, you need to use the Memory Interface Generator (MIG) tool provided by Xilinx, which generates the necessary IP cores and interface logic.
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The maximum clock frequency supported by XC6SLX75-2CSG484C is 450 MHz, but it can be overclocked to higher frequencies with careful design and implementation.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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Yes, XC6SLX75-2CSG484C is suitable for high-reliability applications, as it is fabricated using a 45nm process and has built-in features such as error correction and single-event upset (SEU) mitigation.