Part Details for XC6SLX75T-3FGG676C by AMD Xilinx
Results Overview of XC6SLX75T-3FGG676C by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (7 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
XC6SLX75T-3FGG676C Information
XC6SLX75T-3FGG676C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX75T-3FGG676C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 10 |
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RFQ | ||
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Vyrian | Programmable ICs | 17 |
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RFQ | |
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Win Source Electronics | IC FPGA 348 I/O 676FBGA / FPGA Spartan®-6 LXT Family 74637 Cells 45nm Technology 1.2V 676-Pin FBGA | 800 |
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$471.9000 | Buy Now |
US Tariff Estimator: XC6SLX75T-3FGG676C by AMD Xilinx
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XC6SLX75T-3FGG676C
XC6SLX75T-3FGG676C Part Data Attributes
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XC6SLX75T-3FGG676C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC6SLX75T-3FGG676C
AMD Xilinx
Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA676,26X26,40 | |
| Pin Count | 676 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 862 MHz | |
| Combinatorial Delay of a CLB-Max | 0.21 ns | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 5831 | |
| Number of Inputs | 320 | |
| Number of Logic Cells | 74637 | |
| Number of Outputs | 320 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 5831 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |
Alternate Parts for XC6SLX75T-3FGG676C
This table gives cross-reference parts and alternative options found for XC6SLX75T-3FGG676C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX75T-3FGG676C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC6SLX75T-3FGG676C | AMD | $288.3318 | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 | XC6SLX75T-3FGG676C vs XC6SLX75T-3FGG676C |
| XC6SLX75T-3FGG676I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 | XC6SLX75T-3FGG676C vs XC6SLX75T-3FGG676I |
| XC6SLX75T-3FG676C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, FBGA-676 | XC6SLX75T-3FGG676C vs XC6SLX75T-3FG676C |
| XC6SLX75T-3FG676I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, FBGA-676 | XC6SLX75T-3FGG676C vs XC6SLX75T-3FG676I |
| XC6SLX75T-3FGG676Q | AMD | Check for Price | Field Programmable Gate Array, 5831 CLBs, 74637-Cell, PBGA676, FPBGA-676 | XC6SLX75T-3FGG676C vs XC6SLX75T-3FGG676Q |
| XC6SLX75T-3FG676I | AMD | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, FBGA-676 | XC6SLX75T-3FGG676C vs XC6SLX75T-3FG676I |
| XC6SLX75T-3FG676Q | AMD Xilinx | Check for Price | Field Programmable Gate Array, | XC6SLX75T-3FGG676C vs XC6SLX75T-3FG676Q |
XC6SLX75T-3FGG676C Frequently Asked Questions (FAQ)
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The maximum power consumption of the XC6SLX75T-3FGG676C FPGA is approximately 1.5W, depending on the operating frequency and usage.
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To implement a reliable clocking scheme, use the FPGA's built-in clock management resources, such as the Digital Clock Manager (DCM) and the Phase-Locked Loop (PLL) blocks. These resources allow you to generate and distribute stable clock signals throughout your design.
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To optimize your design for area and speed, use the Xilinx Vivado Design Suite's built-in optimization tools, such as the 'Optimize for Area' and 'Optimize for Speed' options. Additionally, consider using pipelining, parallel processing, and resource sharing to improve performance and reduce area usage.
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To ensure signal integrity and reduce noise in your design, use the FPGA's built-in signal integrity features, such as the Input/Output Buffer Information Specification (IBIS) models and the Xilinx Signal Integrity Wizard. Additionally, consider using differential signaling, shielding, and proper PCB layout techniques to minimize noise and signal degradation.
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The XC6SLX75T-3FGG676C FPGA has an operating temperature range of -40°C to 100°C, making it suitable for use in a wide range of applications, from industrial control systems to aerospace and defense systems.