Part Details for XC7K325T-3FFG900E by AMD Xilinx
Results Overview of XC7K325T-3FFG900E by AMD Xilinx
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (2 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC7K325T-3FFG900E Information
XC7K325T-3FFG900E by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC7K325T-3FFG900E
| Part # | Distributor | Description | Stock | Price | Buy | |
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LCSC | FCBGA-900(31x31) FPGAs (Field Programmable Gate Array) RoHS | 102 |
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$77.8724 / $81.6073 | Buy Now |
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MacroQuest Electronics | FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin FC-BGA | 1200 |
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$2,987.4500 / $3,489.6400 | Buy Now |
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Vyrian | Programmable ICs | 4 |
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RFQ | |
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Win Source Electronics | IC FPGA 500 I/O 900FCBGA / FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin FCBGA Tray | 1580 |
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$82.2858 / $96.0000 | Buy Now |
US Tariff Estimator: XC7K325T-3FFG900E by AMD Xilinx
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XC7K325T-3FFG900E
XC7K325T-3FFG900E Part Data Attributes
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XC7K325T-3FFG900E
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC7K325T-3FFG900E
AMD Xilinx
Field Programmable Gate Array, 25475 CLBs, 1412MHz, 326080-Cell, CMOS, PBGA900, FBGA-900
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Part Package Code | BGA | |
| Package Description | Bga, Bga900,30x30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Schedule B Code | 8542.39.00.00 | |
| CAGE Code | 68994, K7F80 | |
| UNSPSC | 32101643 | |
| Total Weight | 11791.7 | |
| Category CO2 Kg | 495 | |
| CO2 | 5836891.5 | |
| EU RoHS Version | Rohs 2 (2015/863/Eu) | |
| Candidate List Date | 2022-06-10 | |
| CAS Accounted for Wt | 84 | |
| CA Prop 65 Presence | Yes | |
| CA Prop 65 CAS Numbers | 7440-02-0, 13463-67-7, 1333-86-4 | |
| Conflict Mineral Status | Drc Conflict Free | |
| Conflict Mineral Status Source | Cmrt V6.22 | |
| Clock Frequency-Max | 1412 Mhz | |
| Combinatorial Delay of a CLB-Max | 0.58 Ns | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Length | 31 Mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 25475 | |
| Number of Inputs | 500 | |
| Number of Logic Cells | 326080 | |
| Number of Outputs | 500 | |
| Number of Terminals | 900 | |
| Organization | 25475 Clbs | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 Mm | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Terminal Finish | Tin Silver Copper | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 31 Mm |
Alternate Parts for XC7K325T-3FFG900E
This table gives cross-reference parts and alternative options found for XC7K325T-3FFG900E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC7K325T-3FFG900E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC7K325T-3FF900E | AMD | Check for Price | Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA900, | XC7K325T-3FFG900E vs XC7K325T-3FF900E |
| XC7K325T-3FFG900E | AMD | Check for Price | Field Programmable Gate Array, 25475 CLBs, 1412MHz, 326080-Cell, CMOS, PBGA900, | XC7K325T-3FFG900E vs XC7K325T-3FFG900E |
XC7K325T-3FFG900E Frequently Asked Questions (FAQ)
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The maximum power consumption of XC7K325T-3FFG900E is approximately 12W, but it can vary depending on the design and operating conditions.
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You can implement DDR3 memory interface with XC7K325T-3FFG900E using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized DDR3 memory controller IP core that can be integrated into your design.
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The maximum clock frequency supported by XC7K325T-3FFG900E is 500 MHz, but it can vary depending on the design and operating conditions.
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You can optimize the power consumption of XC7K325T-3FFG900E by using power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, you can use Xilinx's Power Analyzer tool to estimate and optimize power consumption.
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The XC7K325T-3FFG900E has a total of 900 I/O pins, but the number of available I/Os depends on the package and the design requirements.