Part Details for XCKU11P-1FFVE1517E by AMD
Results Overview of XCKU11P-1FFVE1517E by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (9 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCKU11P-1FFVE1517E Information
XCKU11P-1FFVE1517E by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCKU11P-1FFVE1517E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
17AH9490
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Newark | Fpga, 653100 Logic Cells, Fcbga-1517, Fpga Type:-, No. Of Logic Cells:653100Logic Cells, Ic Case/Package:Fcbga, No. Of Pins:1517Pins, Speed Grade:1, No.of User I/Os:512I/O S, Process Technology:-, Ic Mounting:Surface Mount Rohs Compliant: Yes |Amd XCKU11P-1FFVE1517E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$3,901.5601 | Buy Now |
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DISTI #
XCKU11P-1FFVE1517E
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Avnet Americas | FPGA Kintex UltraScale+ Family 653100 Cells 20nm 0.85V 1517-Pin FCBGA Tray - Trays (Alt: XCKU11P-1FFVE1517E) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$3,774.6800 | Buy Now |
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DISTI #
XCKU11P-1FFVE1517E
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Avnet Americas | FPGA Kintex UltraScale+ Family 653100 Cells 20nm 0.85V 1517-Pin FCBGA Tray - Trays (Alt: XCKU11P-1FFVE1517E) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$3,774.6800 | Buy Now |
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Chip Stock | FPGAKintexUltraScale+Family653100Cells20nm0.85V1517-PinFCBGATray | 838 |
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RFQ |
US Tariff Estimator: XCKU11P-1FFVE1517E by AMD
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XCKU11P-1FFVE1517E
XCKU11P-1FFVE1517E CAD Models
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XCKU11P-1FFVE1517E Part Data Attributes
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XCKU11P-1FFVE1517E
AMD
Buy Now
Datasheet
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XCKU11P-1FFVE1517E
AMD
Field Programmable Gate Array, 653100-Cell, PBGA1517,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Package Description | Bga-1517 | |
| Reach Compliance Code | Compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| JESD-30 Code | S-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Length | 40 Mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 37320 | |
| Number of Inputs | 512 | |
| Number of Logic Cells | 653100 | |
| Number of Outputs | 512 | |
| Number of Terminals | 1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 37320 Clbs | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Seated Height-Max | 3.51 Mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | Yes | |
| Temperature Grade | Other | |
| Terminal Finish | Tin Silver Copper | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 40 Mm |
Alternate Parts for XCKU11P-1FFVE1517E
This table gives cross-reference parts and alternative options found for XCKU11P-1FFVE1517E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCKU11P-1FFVE1517E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
XCKU11P-1FFVE1517E Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCKU11P-1FFVE1517E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
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The maximum operating temperature of the XCKU11P-1FFVE1517E is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
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To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance traces, and add termination resistors as needed. Additionally, use the FPGA's built-in signal integrity features, such as input/output delay calibration and signal conditioning.
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The maximum clock frequency supported by the XCKU11P-1FFVE1517E is 500 MHz, but it can vary depending on the specific device grade, operating conditions, and design implementation.