There are no models available for this part yet.
Overview of XCV200-6BG256C by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 9 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XCV200-6BG256C by AMD Xilinx
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Bristol Electronics | 19 |
|
RFQ | ||||
| Quest Components | 1 |
|
$231.0000 | Buy Now |
CAD Models for XCV200-6BG256C by AMD Xilinx
Part Data Attributes for XCV200-6BG256C by AMD Xilinx
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
XILINX INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
BGA-256
|
|
Pin Count
|
256
|
|
Reach Compliance Code
|
not_compliant
|
|
HTS Code
|
8542.39.00.01
|
|
Clock Frequency-Max
|
333 MHz
|
|
Combinatorial Delay of a CLB-Max
|
0.6 ns
|
|
JESD-30 Code
|
S-PBGA-B256
|
|
JESD-609 Code
|
e0
|
|
Length
|
27 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of CLBs
|
1176
|
|
Number of Equivalent Gates
|
236666
|
|
Number of Inputs
|
180
|
|
Number of Logic Cells
|
5292
|
|
Number of Outputs
|
180
|
|
Number of Terminals
|
256
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
1176 CLBS, 236666 GATES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA256,20X20,50
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY
|
|
Peak Reflow Temperature (Cel)
|
225
|
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
2.55 mm
|
|
Supply Voltage-Max
|
2.625 V
|
|
Supply Voltage-Min
|
2.375 V
|
|
Supply Voltage-Nom
|
2.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
OTHER
|
|
Terminal Finish
|
Tin/Lead (Sn63Pb37)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
27 mm
|
Alternate Parts for XCV200-6BG256C
This table gives cross-reference parts and alternative options found for XCV200-6BG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCV200-6BG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCV200-6BG256I | Field Programmable Gate Array, 1176 CLBs, 236666 Gates, 333MHz, 5292-Cell, CMOS, PBGA256, BGA-256 | AMD Xilinx | XCV200-6BG256C vs XCV200-6BG256I |
| XCV200-6BGG256C | Field Programmable Gate Array, 1176 CLBs, 236666 Gates, 333MHz, CMOS, PBGA256, BGA-256 | AMD Xilinx | XCV200-6BG256C vs XCV200-6BGG256C |
| XCV200-6BGG256I | Field Programmable Gate Array, 1176 CLBs, 236666 Gates, 333MHz, CMOS, PBGA256, BGA-256 | AMD Xilinx | XCV200-6BG256C vs XCV200-6BGG256I |