Part Details for XCVU13P-L2FHGA2104E by AMD
Results Overview of XCVU13P-L2FHGA2104E by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCVU13P-L2FHGA2104E Information
XCVU13P-L2FHGA2104E by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCVU13P-L2FHGA2104E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCVU13P-L2FHGA2104E
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Avnet Americas | Xilinx Commercial Virtex UltraScale 3780000 System Logic Cells 3456000 CLB Flip-Flops Flip-chip with 1.0mm Ball Pitch Extended Temperature 2104-Pin FCBGA Bulk - Trays (Alt: XCVU13P-L2FHGA2104E) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
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$78,726.8300 | Buy Now |
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DISTI #
XCVU13P-L2FHGA2104E
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Avnet Americas | Xilinx Commercial Virtex UltraScale 3780000 System Logic Cells 3456000 CLB Flip-Flops Flip-chip with 1.0mm Ball Pitch Extended Temperature 2104-Pin FCBGA Bulk - Trays (Alt: XCVU13P-L2FHGA2104E) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
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$78,726.8300 | Buy Now |
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Chip Stock | VirtexUltrascale+FPGA,SpeedGrade-L2,LogicCells3780K,A2104,RoHS | 236 |
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RFQ |
US Tariff Estimator: XCVU13P-L2FHGA2104E by AMD
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XCVU13P-L2FHGA2104E
XCVU13P-L2FHGA2104E Part Data Attributes
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XCVU13P-L2FHGA2104E
AMD
Buy Now
Datasheet
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Compare Parts:
XCVU13P-L2FHGA2104E
AMD
Field Programmable Gate Array,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Reach Compliance Code | Not Compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 20 Weeks | |
| Peak Reflow Temperature (Cel) | Not Specified | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Time@Peak Reflow Temperature-Max (s) | Not Specified |
Alternate Parts for XCVU13P-L2FHGA2104E
This table gives cross-reference parts and alternative options found for XCVU13P-L2FHGA2104E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCVU13P-L2FHGA2104E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XCVU13P-2LFHGA2104E | AMD | Check for Price | Field Programmable Gate Array, | XCVU13P-L2FHGA2104E vs XCVU13P-2LFHGA2104E |
XCVU13P-L2FHGA2104E Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCVU13P-L2FHGA2104E is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
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To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, and use low-power IP cores and primitives. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
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The XCVU13P-L2FHGA2104E has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
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To ensure signal integrity, use the Vivado Design Suite's signal integrity analysis tools, such as the Signal Integrity Wizard and the IBIS-AMI model. Additionally, follow best practices for PCB design, including using controlled impedance, minimizing signal routing, and using termination resistors.
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The XCVU13P-L2FHGA2104E's transceivers support up to 32.75 Gbps data transfer rates, making them suitable for high-speed applications such as PCIe, Ethernet, and other high-bandwidth interfaces.