Part Details for XCVU3P-2FFVC1517I by AMD
Results Overview of XCVU3P-2FFVC1517I by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (7 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCVU3P-2FFVC1517I Information
XCVU3P-2FFVC1517I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCVU3P-2FFVC1517I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
21AH4601
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Newark | Fpga, 862050 Logic Cells, Fcbga-1517, Fpga Type:-, No. Of Logic Cells:862050Logic Cells, Ic Case/Package:Fcbga, No. Of Pins:1517Pins, Speed Grade:2, No.of User I/Os:520I/O S, Process Technology:-, Ic Mounting:Surface Mount Rohs Compliant: Yes |Amd XCVU3P-2FFVC1517I RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$20,684.9102 | Buy Now |
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DISTI #
XCVU3P-2FFVC1517I
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Avnet Americas | FPGA, Virtex UltraScale, 520 I/O's, 862050 Logic Cells, 2 Speed Grade, -40 to 100?C, FCBGA-1517 - Trays (Alt: XCVU3P-2FFVC1517I) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$20,012.2300 | Buy Now |
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DISTI #
XCVU3P-2FFVC1517I
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Avnet Americas | FPGA, Virtex UltraScale, 520 I/O's, 862050 Logic Cells, 2 Speed Grade, -40 to 100?C, FCBGA-1517 - Trays (Alt: XCVU3P-2FFVC1517I) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$20,012.2300 | Buy Now |
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Chip Stock | FPGAVirtexUltraScaleFamily862050Cells20nmTechnology0.95V1517-Pin | 569 |
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RFQ |
US Tariff Estimator: XCVU3P-2FFVC1517I by AMD
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XCVU3P-2FFVC1517I
XCVU3P-2FFVC1517I CAD Models
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XCVU3P-2FFVC1517I Part Data Attributes
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XCVU3P-2FFVC1517I
AMD
Buy Now
Datasheet
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XCVU3P-2FFVC1517I
AMD
Field Programmable Gate Array, 862050-Cell, PBGA1517,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | BGA-1517 | |
| Reach Compliance Code | Compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | S-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Length | 40 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 49260 | |
| Number of Inputs | 520 | |
| Number of Logic Cells | 862050 | |
| Number of Outputs | 520 | |
| Number of Terminals | 1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 49260 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 3.51 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 40 mm |
Alternate Parts for XCVU3P-2FFVC1517I
This table gives cross-reference parts and alternative options found for XCVU3P-2FFVC1517I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCVU3P-2FFVC1517I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XCVU3P-2FFVC1517E | AMD Xilinx | Check for Price | Field Programmable Gate Array, | XCVU3P-2FFVC1517I vs XCVU3P-2FFVC1517E |
XCVU3P-2FFVC1517I Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCVU3P-2FFVC1517I is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
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To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components, reduce clock frequencies, use power-gating, and implement dynamic voltage and frequency scaling (DVFS).
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The maximum operating temperature of the XCVU3P-2FFVC1517I is 100°C (industrial grade) or 125°C (extended temperature range).
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To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, add termination resistors, and use differential signaling where possible. Additionally, follow the PCB design guidelines provided by AMD.
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The maximum bandwidth of the XCVU3P-2FFVC1517I's transceivers is 32.75 Gbps, making them suitable for high-speed applications such as PCIe, SATA, and Ethernet.