Part Details for XCZU19EG-1LFFVE1924I by AMD Xilinx
Overview of XCZU19EG-1LFFVE1924I by AMD Xilinx
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
Part Details for XCZU19EG-1LFFVE1924I
XCZU19EG-1LFFVE1924I CAD Models
XCZU19EG-1LFFVE1924I Part Data Attributes
|
XCZU19EG-1LFFVE1924I
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XCZU19EG-1LFFVE1924I
AMD Xilinx
Microprocessor Circuit,
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Date Of Intro | 2018-03-09 | |
Bus Compatibility | CAN, I2C, SPI, UART | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B1924 | |
JESD-609 Code | e1 | |
Length | 45 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1924 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1924,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 3.71 mm | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 45 mm | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC |