Part Details for ZL50112GAG2 by Microsemi Corporation
Overview of ZL50112GAG2 by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for ZL50112GAG2
Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | IC CESOP PROCESSOR 552BGA | 1120 |
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RFQ |
Part Details for ZL50112GAG2
ZL50112GAG2 CAD Models
ZL50112GAG2 Part Data Attributes:
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ZL50112GAG2
Microsemi Corporation
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Datasheet
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ZL50112GAG2
Microsemi Corporation
Telecom Circuit, 1-Func, PBGA552, 35 X 35 MM, 1.27 MM, LEAD FREE, PLASTIC, BGA-552
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1.27 MM, LEAD FREE, PLASTIC, BGA-552 | |
Pin Count | 552 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B552 | |
JESD-609 Code | e1 | |
Length | 35 mm | |
Number of Functions | 1 | |
Number of Terminals | 552 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA552,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.53 mm | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm |