Part Details for A2F200M3F-FGG256 by Microchip Technology Inc
Overview of A2F200M3F-FGG256 by Microchip Technology Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
Price & Stock for A2F200M3F-FGG256
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1100-1003-ND
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DigiKey | IC SOC CORTEX-M3 80MHZ 256FBGA Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
DISTI #
A2F200M3F-FGG256
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Avnet Americas | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA - Trays (Alt: A2F200M3F-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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Onlinecomponents.com | RoHS: Compliant | 145 Factory Stock |
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$0 | Buy Now |
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NAC | A2F200M3F-FGG256 RoHS: Compliant Min Qty: 90 Package Multiple: 1 Container: Tray | 0 |
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RFQ | |
DISTI #
A2F200M3F-FGG256
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Avnet Silica | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA (Alt: A2F200M3F-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
A2F200M3F-FGG256
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EBV Elektronik | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA (Alt: A2F200M3F-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 17 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for A2F200M3F-FGG256
A2F200M3F-FGG256 CAD Models
A2F200M3F-FGG256 Part Data Attributes
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A2F200M3F-FGG256
Microchip Technology Inc
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Datasheet
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A2F200M3F-FGG256
Microchip Technology Inc
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 16 Weeks | |
JESD-30 Code | S-PBGA-B256 | |
Length | 17 mm | |
Number of Equivalent Gates | 200000 | |
Number of Inputs | 117 | |
Number of Logic Cells | 4608 | |
Number of Outputs | 117 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 200000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Programmable Logic Type | FPGA SOC | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm |