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A2F200M3F-FGG256 by:

Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256

Part Details for A2F200M3F-FGG256 by Microchip Technology Inc

Overview of A2F200M3F-FGG256 by Microchip Technology Inc

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Financial Technology (Fintech) Computing and Data Storage Smart Cities Aerospace and Defense Telecommunications Communication and Networking Automotive

Price & Stock for A2F200M3F-FGG256

Part # Distributor Description Stock Price Buy
DISTI # 1100-1003-ND
DigiKey IC SOC CORTEX-M3 80MHZ 256FBGA Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
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DISTI # A2F200M3F-FGG256
Avnet Americas FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA - Trays (Alt: A2F200M3F-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 16 Weeks, 0 Days Container: Tray 0
RFQ
Onlinecomponents.com   RoHS: Compliant 145 Factory Stock
  • 0 $0
$0 Buy Now
NAC A2F200M3F-FGG256 RoHS: Compliant Min Qty: 90 Package Multiple: 1 Container: Tray 0
RFQ
DISTI # A2F200M3F-FGG256
Avnet Silica FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA (Alt: A2F200M3F-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 18 Weeks, 0 Days Silica - 0
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DISTI # A2F200M3F-FGG256
EBV Elektronik FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA (Alt: A2F200M3F-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 17 Weeks, 0 Days EBV - 0
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Part Details for A2F200M3F-FGG256

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A2F200M3F-FGG256 Part Data Attributes

A2F200M3F-FGG256 Microchip Technology Inc
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A2F200M3F-FGG256 Microchip Technology Inc Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 16 Weeks
JESD-30 Code S-PBGA-B256
Length 17 mm
Number of Equivalent Gates 200000
Number of Inputs 117
Number of Logic Cells 4608
Number of Outputs 117
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 200000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Programmable Logic Type FPGA SOC
Seated Height-Max 1.7 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm

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