Datasheets
AD9174BBPZ by: Analog Devices Inc

Dual, 16-Bit, 12.6 GSPS RF DAC and Direct Digital Synthesizer

Part Details for AD9174BBPZ by Analog Devices Inc

Results Overview of AD9174BBPZ by Analog Devices Inc

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

AD9174BBPZ Information

AD9174BBPZ by Analog Devices Inc is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for AD9174BBPZ

Part # Distributor Description Stock Price Buy
DISTI # 49AK9831
Newark Da Converter, 16Bit, 12.6Gsps, Bga, Resolution (Bits):16Bit, Sampling Rate:12.6Gsps, Data Interface:Serial, Spi, Supply Voltage Range:950Mv To 1.05V, 1.71V To 1.89V, Adc/Dac Case Style:Bga, No. Of Pins:144Pins Rohs Compliant: Yes |Analog Devices AD9174BBPZ RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 1
  • 1 $769.6500
$769.6500 Buy Now
Vyrian Converters 4
RFQ

Part Details for AD9174BBPZ

AD9174BBPZ CAD Models

AD9174BBPZ Part Data Attributes

AD9174BBPZ Analog Devices Inc
Buy Now Datasheet
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AD9174BBPZ Analog Devices Inc Dual, 16-Bit, 12.6 GSPS RF DAC and Direct Digital Synthesizer
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Package Description BGA-144
Pin Count 144
Manufacturer Package Code BP-144-1
Reach Compliance Code compliant
ECCN Code 3A001.A.5.B.2.A
HTS Code 8542.39.00.01
Date Of Intro 2018-11-05
Samacsys Manufacturer Analog Devices
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code S-PBGA-B144
JESD-609 Code e1
Length 10 mm
Moisture Sensitivity Level 3
Number of Bits 16
Number of Functions 2
Number of Terminals 144
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.71 mm
Supply Voltage-Nom 1 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm

AD9174BBPZ Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a dedicated ground plane and a solid power plane is recommended. The device should be placed near the center of the board, and the analog and digital sections should be separated to minimize noise coupling.

  • Use a high-quality clock source with low jitter (<100 fs) and ensure that the clock frequency is within the recommended range (1.5 GHz to 2.5 GHz). Also, ensure that the clock signal is properly terminated and routed to minimize signal degradation.

  • Power up the device in the following sequence: AVDD, DVDD, and then CLKIN. Power down in the reverse sequence. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.

  • Use a separate analog and digital ground plane, and ensure that the digital signals are routed away from the analog signals. Use shielding and filtering to minimize electromagnetic interference (EMI).

  • Perform a full calibration cycle after power-up, and re-calibrate as needed based on temperature changes or other environmental factors. Refer to the datasheet for the recommended calibration sequence and timing.

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