Part Details for AD9866BCP by Rochester Electronics LLC
Overview of AD9866BCP by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
AD9866BCPZRL | Analog Devices | 12B Integrated Physical Layer | |
AD9866BCPZ | Analog Devices | 12B Integrated Physical Layer |
Part Details for AD9866BCP
AD9866BCP CAD Models
AD9866BCP Part Data Attributes
|
AD9866BCP
Rochester Electronics LLC
Buy Now
Datasheet
|
Compare Parts:
AD9866BCP
Rochester Electronics LLC
SPECIALTY TELECOM CIRCUIT, QCC64, MO-220-VMMD, LFCSP-64
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS INC | |
Part Package Code | QFN | |
Package Description | HVQCCN, | |
Pin Count | 64 | |
Reach Compliance Code | unknown | |
JESD-30 Code | S-XQCC-N64 | |
JESD-609 Code | e0 | |
Length | 9 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 64 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 240 | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 1 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 9 mm |