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Signal Circuits / Multiplexers or Switches / ADG772BCPZ-REEL7
Datasheets
ADG772BCPZ-REEL7 by:

CMOS Low Power Dual 2:1 Mux/Demux USB 2.0 (480 Mbps)/USB 1.1 (12 Mbps)

Part Details for ADG772BCPZ-REEL7 by Analog Devices Inc

Results Overview of ADG772BCPZ-REEL7 by Analog Devices Inc

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Communication and Networking Automotive

ADG772BCPZ-REEL7 Information

ADG772BCPZ-REEL7 by Analog Devices Inc is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Price & Stock for ADG772BCPZ-REEL7

Part # Distributor Description Stock Price Buy
DISTI # 60AK4990
Newark Analogue Switch, 2Ch, Spdt, Lfcsp-Uq, Ic Function:Analog Multiplexer/Demultiplexer, Power Supply Type:Single Supply, Supply Voltage Range:2.7V To 3.6V, Ic Case/Package:Lfcsp-Uq, No. Of Pins:10Pins, No. Of Channels:2Channels Rohs Compliant: Yes |Analog Devices ADG772BCPZ-REEL7 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape 4158
  • 1 $2.6600
  • 10 $2.3000
  • 50 $2.0200
  • 100 $1.8900
  • 500 $1.2300
  • 1,000 $1.2200
  • 2,500 $1.2100
  • 5,000 $1.1900
$1.1900 / $2.6600 Buy Now
Analog Devices Inc 10 ld 1.3 x 1.6mm mini LFCSP, Min Qty: 3000 Package Multiple: 3000 3000
  • 1 $4.0200
  • 10 $2.6510
  • 25 $2.2940
  • 100 $1.8928
  • 250 $1.6977
  • 500 $1.5786
  • 1,000 $1.4797
  • 3,000 $1.3561
  • 6,000 $1.2950
$1.2950 / $4.0200 Buy Now
Bristol Electronics   6
RFQ
Velocity Electronics Our Stock 38
RFQ
Chip-Germany GmbH   RoHS: Not Compliant 2212
RFQ
Win Source Electronics CMOS Low Power Dual 2:1 Mux/Demux USB 2.0 (480 Mbps)/USB 1.1 (12 Mbps) 37140
  • 50 $1.0915
  • 100 $1.0211
  • 155 $0.9859
  • 220 $0.9155
  • 285 $0.8803
  • 355 $0.8451
$0.8451 / $1.0915 Buy Now

Part Details for ADG772BCPZ-REEL7

ADG772BCPZ-REEL7 CAD Models

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ADG772BCPZ-REEL7 Part Data Attributes

Parametric Data
ADG772BCPZ-REEL7 Analog Devices Inc
Buy Now Datasheet
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ADG772BCPZ-REEL7 Analog Devices Inc CMOS Low Power Dual 2:1 Mux/Demux USB 2.0 (480 Mbps)/USB 1.1 (12 Mbps)
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Part Package Code QFN
Package Description 1.30 X 1.60 MM, ROHS COMPLIANT, LFCSP-10
Pin Count 10
Manufacturer Package Code CP-10-10
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Analog Devices
Analog IC - Other Type SPDT
JESD-30 Code R-XQCC-N10
JESD-609 Code e4
Length 1.6 mm
Moisture Sensitivity Level 1
Number of Channels 1
Number of Functions 2
Number of Terminals 10
Off-state Isolation-Nom 73 dB
On-state Resistance Match-Nom 0.04 Ω
On-state Resistance-Max (Ron) 8.8 Ω
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code VQCCN
Package Equivalence Code LCC10,.05X.06,16
Package Shape RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.6 mm
Signal Current-Max 0.035 A
Supply Current-Max (Isup) 0.001 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Switch-off Time-Max 10 ns
Switch-on Time-Max 13.5 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD
Terminal Pitch 0.4 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 1.3 mm

Alternate Parts for ADG772BCPZ-REEL7

This table gives cross-reference parts and alternative options found for ADG772BCPZ-REEL7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADG772BCPZ-REEL7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
ADG772BCPZ-1REEL Analog Devices Inc $1.5045 CMOS Low Power Dual 2:1 Mux/Demux USB 2.0 (480 Mbps)/USB 1.1 (12 Mbps) ADG772BCPZ-REEL7 vs ADG772BCPZ-1REEL
ADG772BCPZ-REEL Analog Devices Inc Check for Price IC DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, QCC10, 1.30 X 1.60 MM, ROHS COMPLIANT, LFCSP-10, Multiplexer or Switch ADG772BCPZ-REEL7 vs ADG772BCPZ-REEL

ADG772BCPZ-REEL7 Related Parts

ADG772BCPZ-REEL7 Frequently Asked Questions (FAQ)

  • A good PCB layout for the ADG772BCPZ-REEL7 should include a solid ground plane, decoupling capacitors near the device, and a thermal pad connected to a heat sink or a thermal relief pattern. The device should be placed away from high-frequency signals and noise sources.

  • To ensure reliability and longevity, operate the ADG772BCPZ-REEL7 within its recommended operating temperature range (−40°C to +125°C). Use a heat sink or thermal relief pattern to dissipate heat, and avoid exceeding the maximum junction temperature (150°C).

  • When selecting external components, consider the operating frequency, signal amplitude, and impedance matching. Choose components with low ESR and high Q-factor for optimal performance. Ensure the components are rated for the operating voltage and temperature range.

  • To troubleshoot issues, check the power supply voltage, input signals, and output loads. Verify the device is operated within its recommended specifications. Use an oscilloscope to monitor the output voltage and current. Check for PCB layout issues, such as noise coupling or thermal issues.

  • Recommended testing procedures include functional testing, parametric testing, and environmental testing. Validate the device's performance using a test fixture or a production test board. Perform tests at multiple temperatures and operating conditions to ensure compliance with specifications.

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