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Part Details for ADSP-21060LCW-160 by Analog Devices Inc
Results Overview of ADSP-21060LCW-160 by Analog Devices Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ADSP-21060LCW-160 Information
ADSP-21060LCW-160 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ADSP-21060LCW-160
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | SHARC IND. 3V 40MHZ CQFP HEAT Package Multiple: 1 | 0 |
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Buy Now | |
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DISTI #
ADSP21060LCW160
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Richardson RFPD | DIGITAL SIGNAL PROCESSOR IC RoHS: Compliant Min Qty: 1 | 0 |
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RFQ | |
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Vyrian | Peripheral ICs | 420 |
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RFQ | |
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Win Source Electronics | SHARC Processor | 153 |
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$2,749.2253 | Buy Now |
Part Details for ADSP-21060LCW-160
ADSP-21060LCW-160 CAD Models
ADSP-21060LCW-160 Part Data Attributes
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ADSP-21060LCW-160
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-21060LCW-160
Analog Devices Inc
SHARC, 120 MFLOPS, 3.3 v, floating point
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | QFP | |
| Package Description | THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP-240 | |
| Pin Count | 240 | |
| Manufacturer Package Code | QS-240-1A | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Address Bus Width | 32 | |
| Barrel Shifter | YES | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | 48 | |
| Format | FLOATING POINT | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-CQFP-G240 | |
| JESD-609 Code | e4 | |
| Length | 32 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 240 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Qualification Status | Not Qualified | |
| RAM (words) | 131072 | |
| Seated Height-Max | 4.2 mm | |
| Supply Current-Max | 600 mA | |
| Supply Voltage-Max | 3.45 V | |
| Supply Voltage-Min | 3.15 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Gold (Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
Alternate Parts for ADSP-21060LCW-160
This table gives cross-reference parts and alternative options found for ADSP-21060LCW-160. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADSP-21060LCW-160, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| ADSP-21060LCW-133 | Analog Devices Inc | Check for Price | 48-BIT, 33.3MHz, OTHER DSP, CQFP240, THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP-240 | ADSP-21060LCW-160 vs ADSP-21060LCW-133 |
ADSP-21060LCW-160 Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VDD (core voltage) first, followed by VIO (I/O voltage) and then the clock signal. This ensures proper device initialization and prevents latch-up.
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The ADSP-21060LCW-160 has a flexible memory architecture. To optimize memory configuration, consider the specific requirements of your application, such as data and program memory needs, and configure the memory accordingly using the device's memory control registers.
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The ADSP-21060LCW-160 is a high-performance processor that can generate significant heat. Ensure proper thermal management by providing adequate heat sinking, using thermal interface materials, and following recommended PCB design guidelines to prevent overheating.
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The ADSP-21060LCW-160 has various low-power modes, including idle, sleep, and shutdown modes. Implement these modes by configuring the device's power management registers and using the device's built-in power management features to reduce power consumption.
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To minimize EMI and ensure EMC, follow proper PCB design guidelines, use shielding and filtering techniques, and ensure that the device is properly grounded. Additionally, consider using EMI-reducing components and following regulatory guidelines for EMI and EMC compliance.