Datasheets
AGLN250V2-VQG100I by:

Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

Part Details for AGLN250V2-VQG100I by Microsemi Corporation

Results Overview of AGLN250V2-VQG100I by Microsemi Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

AGLN250V2-VQG100I Information

AGLN250V2-VQG100I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Part Details for AGLN250V2-VQG100I

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AGLN250V2-VQG100I Part Data Attributes

AGLN250V2-VQG100I Microsemi Corporation
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AGLN250V2-VQG100I Microsemi Corporation Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
JESD-30 Code S-PQFP-G100
JESD-609 Code e3
Length 14 mm
Moisture Sensitivity Level 3
Number of CLBs 6144
Number of Equivalent Gates 250000
Number of Terminals 100
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm

Alternate Parts for AGLN250V2-VQG100I

This table gives cross-reference parts and alternative options found for AGLN250V2-VQG100I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AGLN250V2-VQG100I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
AGLN250V2-VQG100 Microchip Technology Inc Check for Price Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100 AGLN250V2-VQG100I vs AGLN250V2-VQG100
AGLN250V2-VQG100 Actel Corporation Check for Price Field Programmable Gate Array, 6144 CLBs, 250000 Gates, 250MHz, 6144-Cell, CMOS, PQFP100, 14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, GREEN, VQFP-100 AGLN250V2-VQG100I vs AGLN250V2-VQG100
AGLN250V2-VQ100 Microchip Technology Inc $27.4864 Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100 AGLN250V2-VQG100I vs AGLN250V2-VQ100
AGLN250V2-VQ100 Actel Corporation Check for Price Field Programmable Gate Array, 6144 CLBs, 250000 Gates, 250MHz, 6144-Cell, CMOS, PQFP100, 14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, VQFP-100 AGLN250V2-VQG100I vs AGLN250V2-VQ100
AGLN250V2-VQ100I Actel Corporation Check for Price Field Programmable Gate Array, 6144 CLBs, 250000 Gates, 250MHz, 6144-Cell, CMOS, PQFP100, 14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, VQFP-100 AGLN250V2-VQG100I vs AGLN250V2-VQ100I

AGLN250V2-VQG100I Related Parts

AGLN250V2-VQG100I Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.

  • Ensure that the device is operated within the recommended temperature range (–40°C to 100°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.

  • Power-up sequence: VCC, then VIN. Power-down sequence: VIN, then VCC. Ensure that VCC is powered up before VIN to prevent damage to the device.

  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure that the ESD protection devices are rated for the maximum voltage and current of the application.

  • Use 0.1 μF to 1 μF ceramic capacitors with a voltage rating of 10 V or higher. Place the decoupling capacitors as close as possible to the device's power pins.

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