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Overview of AM27S191LMB by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
CAD Models for AM27S191LMB by AMD
Part Data Attributes for AM27S191LMB by AMD
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Package Description
|
QCCN, LCC32,.45X.55
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
Access Time-Max
|
65 ns
|
JESD-30 Code
|
R-XQCC-N32
|
JESD-609 Code
|
e0
|
Memory Density
|
16384 bit
|
Memory IC Type
|
MEMORY CIRCUIT
|
Memory Width
|
8
|
Number of Terminals
|
32
|
Number of Words
|
2048 words
|
Number of Words Code
|
2000
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Organization
|
2KX8
|
Package Body Material
|
CERAMIC
|
Package Code
|
QCCN
|
Package Equivalence Code
|
LCC32,.45X.55
|
Package Shape
|
RECTANGULAR
|
Package Style
|
CHIP CARRIER
|
Qualification Status
|
Not Qualified
|
Screening Level
|
MIL-STD-883 Class B (Modified)
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
YES
|
Technology
|
TTL
|
Temperature Grade
|
MILITARY
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
QUAD
|