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Overview of APTM100SK33T1G by Microsemi Corporation
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for APTM100SK33T1G by Microsemi Corporation
Part Data Attributes for APTM100SK33T1G by Microsemi Corporation
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Package Description
|
ROHS COMPLIANT, SP1, 12 PIN
|
Pin Count
|
12
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
Samacsys Manufacturer
|
Microsemi Corporation
|
Additional Feature
|
AVALANCHE RATED
|
Case Connection
|
ISOLATED
|
Configuration
|
SINGLE WITH BUILT-IN DIODE AND THERMISTOR
|
DS Breakdown Voltage-Min
|
1000 V
|
Drain Current-Max (ID)
|
23 A
|
Drain-source On Resistance-Max
|
0.396 Ω
|
FET Technology
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code
|
R-XUFM-X12
|
JESD-609 Code
|
e1
|
Moisture Sensitivity Level
|
1
|
Number of Elements
|
1
|
Number of Terminals
|
12
|
Operating Mode
|
ENHANCEMENT MODE
|
Operating Temperature-Max
|
150 °C
|
Package Body Material
|
UNSPECIFIED
|
Package Shape
|
RECTANGULAR
|
Package Style
|
FLANGE MOUNT
|
Polarity/Channel Type
|
N-CHANNEL
|
Power Dissipation-Max (Abs)
|
390 W
|
Pulsed Drain Current-Max (IDM)
|
140 A
|
Qualification Status
|
Not Qualified
|
Surface Mount
|
NO
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
UNSPECIFIED
|
Terminal Position
|
UPPER
|
Transistor Application
|
SWITCHING
|
Transistor Element Material
|
SILICON
|
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