Datasheets
B500C3700-2200A by: Diotec Semiconductor AG

Bridge Rectifier Diode, 1 Phase, 2.7A, 1000V V(RRM), Silicon, 32 X 5.60 MM, 17 MM HEIGHT, ROHS COMPLIANT, PLASTIC PACKAGE-4

Part Details for B500C3700-2200A by Diotec Semiconductor AG

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B500C3700-2200A Information

B500C3700-2200A by Diotec Semiconductor AG is a Bridge Rectifier Diode.
Bridge Rectifier Diodes are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

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Part Details for B500C3700-2200A

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B500C3700-2200A Part Data Attributes

B500C3700-2200A Diotec Semiconductor AG
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B500C3700-2200A Diotec Semiconductor AG Bridge Rectifier Diode, 1 Phase, 2.7A, 1000V V(RRM), Silicon, 32 X 5.60 MM, 17 MM HEIGHT, ROHS COMPLIANT, PLASTIC PACKAGE-4
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer DIOTEC SEMICONDUCTOR AG
Package Description R-PSIP-P4
Pin Count 4
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.10.00.80
Configuration BRIDGE, 4 ELEMENTS
Diode Element Material SILICON
Diode Type BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1 V
JESD-30 Code R-PSIP-P4
Non-rep Pk Forward Current-Max 165 A
Number of Elements 4
Number of Phases 1
Number of Terminals 4
Operating Temperature-Max 150 °C
Operating Temperature-Min -50 °C
Output Current-Max 2.7 A
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Reference Standard UL RECOGNIZED
Rep Pk Reverse Voltage-Max 1000 V
Reverse Current-Max 5 µA
Reverse Recovery Time-Max 1.5 µs
Reverse Test Voltage 1000 V
Surface Mount NO
Terminal Form PIN/PEG
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

B500C3700-2200A Related Parts

B500C3700-2200A Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 10mm x 10mm, using a 2oz copper layer, and ensuring good thermal conduction to the surrounding copper areas.

  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.

  • The recommended soldering conditions for the B500C3700-2200A are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC-J-STD-020D standard.

  • Yes, the B500C3700-2200A can be used in switching regulator applications, but it's essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.

  • To protect the device from EOS and ESD, it's recommended to use a robust PCB design, follow proper handling and storage procedures, and consider using external protection devices such as TVS diodes or ESD protection arrays.

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