Part Details for BGM15LA12E6327XTSA1 by Infineon Technologies AG
Overview of BGM15LA12E6327XTSA1 by Infineon Technologies AG
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Consumer Electronics
Internet of Things (IoT)
Audio and Video Systems
Smart Cities
Price & Stock for BGM15LA12E6327XTSA1
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BGM15LA12E6327XTSA1
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Avnet Americas | LNA Multiplexer Module, for LTE Low-band Frequencies, 12-Pin ATSLP T/R - Tape and Reel (Alt: BGM15LA12E6327XTSA1) RoHS: Compliant Min Qty: 4500 Package Multiple: 4500 Container: Reel | 0 |
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RFQ | |
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Rochester Electronics | BGM15LA12 - RF Modules (LMM) RoHS: Compliant Status: Obsolete Min Qty: 1 | 40158 |
|
$0.4344 / $0.5110 | Buy Now |
DISTI #
BGM15LA12E6327XTSA1
|
Avnet Americas | LNA Multiplexer Module, for LTE Low-band Frequencies, 12-Pin ATSLP T/R - Tape and Reel (Alt: BGM15LA12E6327XTSA1) RoHS: Compliant Min Qty: 4500 Package Multiple: 4500 Container: Reel | 0 |
|
RFQ | |
DISTI #
BGM15LA12E6327XTSA1
|
Avnet Americas | LNA Multiplexer Module, for LTE Low-band Frequencies, 12-Pin ATSLP T/R - Tape and Reel (Alt: BGM15LA12E6327XTSA1) RoHS: Compliant Min Qty: 4500 Package Multiple: 4500 Container: Reel | 0 |
|
RFQ |
Part Details for BGM15LA12E6327XTSA1
BGM15LA12E6327XTSA1 CAD Models
BGM15LA12E6327XTSA1 Part Data Attributes
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BGM15LA12E6327XTSA1
Infineon Technologies AG
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Datasheet
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BGM15LA12E6327XTSA1
Infineon Technologies AG
Telecom Circuit, 1-Func, 1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | 1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Infineon | |
JESD-30 Code | R-XBCC-B12 | |
JESD-609 Code | e4 | |
Length | 1.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 12 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | BCC | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Seated Height-Max | 0.65 mm | |
Supply Voltage-Nom | 2.8 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | GOLD NICKEL | |
Terminal Form | BUTT | |
Terminal Pitch | 0.4 mm | |
Terminal Position | BOTTOM | |
Width | 1.1 mm |