Part Details for BGS13SL9E6327XTSA1 by Infineon Technologies AG
Overview of BGS13SL9E6327XTSA1 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for BGS13SL9E6327XTSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | BGS13S - General Purpose Switch SP3T ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 2444879 |
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$0.2610 / $0.3071 | Buy Now |
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Chip1Cloud | IC SWITCH RF SP3T TSLP9-3 / RF Switch SP3T 100MHz to 3GHz 18dB 9-Pin TSLP T/R | 2230 |
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RFQ | |
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DISTI #
2480597
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Farnell | RF SWITCH, SP3T, 3GHZ, TSLP-9 RoHS: Compliant Min Qty: 1 Lead time: 27 Weeks, 1 Days Container: Cut Tape | 0 |
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$0.2888 / $0.6780 | Buy Now |
Part Details for BGS13SL9E6327XTSA1
BGS13SL9E6327XTSA1 CAD Models
BGS13SL9E6327XTSA1 Part Data Attributes:
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BGS13SL9E6327XTSA1
Infineon Technologies AG
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Datasheet
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BGS13SL9E6327XTSA1
Infineon Technologies AG
Telecom Circuit, 1-Func, 1.15 X 1.15 MM, 0.31 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TSLP-9
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 1.15 X 1.15 MM, 0.31 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TSLP-9 | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-XBCC-B9 | |
| Length | 1.15 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 9 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | BCC | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Seated Height-Max | 0.32 mm | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | OTHER | |
| Terminal Form | BUTT | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Width | 1.15 mm |