Part Details for BGSF110GN26E6327XTSA1 by Infineon Technologies AG
Overview of BGSF110GN26E6327XTSA1 by Infineon Technologies AG
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for BGSF110GN26E6327XTSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | BGSF 110GN26 E6327 - Multi Chip Module RoHS: Compliant Status: Obsolete Min Qty: 1 | 321980 |
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$1.0100 / $1.1800 | Buy Now |
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DISTI #
SP001006660
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EBV Elektronik | RF Switch SP10T 100MHz to 3800MHz 37dB 26-Pin TSNP T/R (Alt: SP001006660) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 7 Weeks, 4 Days | EBV - 0 |
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Buy Now |
Part Details for BGSF110GN26E6327XTSA1
BGSF110GN26E6327XTSA1 CAD Models
BGSF110GN26E6327XTSA1 Part Data Attributes
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BGSF110GN26E6327XTSA1
Infineon Technologies AG
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Datasheet
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Compare Parts:
BGSF110GN26E6327XTSA1
Infineon Technologies AG
SP10T, 3800MHz Max, 1 Func, 1.63dB Insertion Loss-Max, CMOS,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | HQCCN, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | R-PQCC-N26 | |
| JESD-609 Code | e4 | |
| Length | 3.4 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 26 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HQCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.77 mm | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | OTHER | |
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | |
| Terminal Form | NO LEAD | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 2.6 mm |
Alternate Parts for BGSF110GN26E6327XTSA1
This table gives cross-reference parts and alternative options found for BGSF110GN26E6327XTSA1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BGSF110GN26E6327XTSA1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| BGSF110GN26 | Telecom Circuit, 1-Func, PQCC26, 3.40 X 2.60 MM, 0.73 MM HEIGHT, GREEN, PLASTIC, TSNP-26 | Infineon Technologies AG | BGSF110GN26E6327XTSA1 vs BGSF110GN26 |