Part Details for BGT24MTR11E6327XUSA1 by Infineon Technologies AG
Overview of BGT24MTR11E6327XUSA1 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Automotive
Price & Stock for BGT24MTR11E6327XUSA1
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BGT24MTR11E6327XUS
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Avnet Americas | RF Transceiver 3.3V 32-Pin QFN Tape and Reel - Tape and Reel (Alt: BGT24MTR11E6327XUS) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0 |
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RFQ |
Part Details for BGT24MTR11E6327XUSA1
BGT24MTR11E6327XUSA1 CAD Models
BGT24MTR11E6327XUSA1 Part Data Attributes
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BGT24MTR11E6327XUSA1
Infineon Technologies AG
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Datasheet
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BGT24MTR11E6327XUSA1
Infineon Technologies AG
Telecom Circuit, 1-Func, Bipolar, PQCC32, VQFN-32
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | VQFN-32 | |
Reach Compliance Code | compliant | |
JESD-30 Code | R-PQCC-N32 | |
Length | 5.5 mm | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 0.9 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 4.5 mm |