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Drivers And Interfaces / Peripheral Drivers / BSP75NHUMA1
Datasheets
BSP75NHUMA1 by: Infineon Technologies AG

Buffer/Inverter Based Peripheral Driver, 0.7A, PDSO4, GREEN, PLASTIC, SOT-223, 4 PIN

Part Details for BSP75NHUMA1 by Infineon Technologies AG

Results Overview of BSP75NHUMA1 by Infineon Technologies AG

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

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BSP75NHUMA1 Information

BSP75NHUMA1 by Infineon Technologies AG is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for BSP75NHUMA1

Part # Distributor Description Stock Price Buy
DISTI # 47W3340
Newark Power Load Sw, Low Side, -40 To 150Deg C, Power Load Switch Type:Low Side, No. Of Channels:1Channels, Input Voltage:20V, Current Limit:1A, On State Resistance:0.55Ohm, Ic Case/Package:Sot-223, No. Of Pins:4Pins, Product Range:- Rohs Compliant: Yes |Infineon BSP75NHUMA1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 2012
  • 1 $1.5700
$1.5700 Buy Now
DISTI # BSP75NHUMA1
Avnet Americas Power Switch Lo Side 0.7A 4-Pin SOT-223 T/R - Tape and Reel (Alt: BSP75NHUMA1) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 8 Weeks, 0 Days Container: Reel 0
  • 4,000 $0.7215
  • 8,000 $0.7158
  • 16,000 $0.7103
  • 24,000 $0.7046
  • 32,000 $0.6990
$0.6990 / $0.7215 Buy Now
Bristol Electronics   3
RFQ
Rochester Electronics N channel vertical power FET in Smart SIPMOS technology RoHS: Compliant Status: Obsolete Min Qty: 1 844
  • 1 $0.7817
  • 25 $0.7661
  • 100 $0.7348
  • 500 $0.7035
  • 1,000 $0.6644
$0.6644 / $0.7817 Buy Now
Ameya Holding Limited BSP75N Series 60 V 700 mA SMT Smart Low Side Power Switch - SOT-223-4 6188
RFQ
DISTI # C1S322000151093
Chip One Stop Power Switch Lo Side 1-OUT 0.7A 0.49Ohm Automotive 4-Pin(3+Tab) SOT-223 RoHS: Compliant pbFree: Yes Container: Cut Tape 3889
  • 1 $1.1900
  • 10 $1.1700
  • 50 $1.1600
  • 100 $1.1500
  • 200 $1.0900
  • 1,000 $1.0000
  • 2,000 $0.9540
$0.9540 / $1.1900 Buy Now
Chip-Germany GmbH   RoHS: Not Compliant 16
RFQ
Component Electronics, Inc IN STOCK SHIP TODAY 8
  • 1 $1.5400
  • 100 $1.1500
  • 1,000 $1.0000
$1.0000 / $1.5400 Buy Now
DISTI # SP000305171
EBV Elektronik Power Switch Lo Side 0.7A 4-Pin SOT-223 T/R (Alt: SP000305171) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 9 Weeks, 0 Days EBV - 0
Buy Now
Win Source Electronics IC PWR SWTCH N-CHAN 1:1 SOT223-4 / Power Switch/Driver 1:1 N-Channel 700mA PG-SOT223-4 264100
  • 100 $0.5203
  • 210 $0.4868
  • 320 $0.4700
  • 460 $0.4364
  • 600 $0.4196
  • 745 $0.4029
$0.4029 / $0.5203 Buy Now

Part Details for BSP75NHUMA1

BSP75NHUMA1 CAD Models

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BSP75NHUMA1 Part Data Attributes

Parametric Data
BSP75NHUMA1 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
BSP75NHUMA1 Infineon Technologies AG Buffer/Inverter Based Peripheral Driver, 0.7A, PDSO4, GREEN, PLASTIC, SOT-223, 4 PIN
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code End Of Life
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code SOT-223
Package Description SOT-223, 4 PIN
Pin Count 4
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 8 Weeks
Samacsys Manufacturer Infineon
Built-in Protections TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
Driver Number of Bits 1
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G4
JESD-609 Code e3
Length 6.5 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 4
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Output Current Flow Direction SINK
Output Peak Current Limit-Nom 1.5 A
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOT-223
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Seated Height-Max 1.8 mm
Supply Current-Max 2 mA
Supply Voltage-Nom 5 V
Supply Voltage1-Max 75 V
Supply Voltage1-Min 60 V
Surface Mount YES
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 2.3 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Turn-off Time 20 µs
Turn-on Time 20 µs
Width 3.5 mm

Alternate Parts for BSP75NHUMA1

This table gives cross-reference parts and alternative options found for BSP75NHUMA1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BSP75NHUMA1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
BSP75N Infineon Technologies AG Check for Price Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.7A, MOS, PDSO4, GREEN, PLASTIC, SOT-223, 4 PIN BSP75NHUMA1 vs BSP75N

BSP75NHUMA1 Related Parts

BSP75NHUMA1 Frequently Asked Questions (FAQ)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.

  • The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to provide a stable voltage and current to the device.

  • For high-frequency operation, it's essential to minimize parasitic inductance and capacitance. Use a ground plane, keep signal traces short and wide, and avoid vias and right-angle bends in the signal path.

  • Use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins. Ensure that the PCB design includes a clear path to ground for ESD discharge.

  • For high-power applications, ensure good thermal contact between the device and a heat sink. Use a thermal interface material (TIM) and a heat sink with a high thermal conductivity. Ensure good airflow around the heat sink.

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