Datasheets
BSP762TXUMA1 by: Infineon Technologies AG

Buffer/Inverter Based Peripheral Driver, 10A, MOS, PDSO8, GREEN, PLASTIC, SO-8

Part Details for BSP762TXUMA1 by Infineon Technologies AG

Results Overview of BSP762TXUMA1 by Infineon Technologies AG

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BSP762TXUMA1 Information

BSP762TXUMA1 by Infineon Technologies AG is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for BSP762TXUMA1

Part # Distributor Description Stock Price Buy
DISTI # 2215493
element14 Asia-Pacific , , DSO-8 RoHS: Compliant Min Qty: 1 Container: Each 8009
  • 1 $2.3200
  • 10 $1.5700
  • 50 $1.4900
  • 100 $1.4000
  • 250 $1.3200
  • 500 $1.2800
  • 1,000 $1.2400
  • 2,500 $1.1100
$1.1100 / $2.3200 Buy Now

Part Details for BSP762TXUMA1

BSP762TXUMA1 CAD Models

BSP762TXUMA1 Part Data Attributes

BSP762TXUMA1 Infineon Technologies AG
Buy Now Datasheet
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BSP762TXUMA1 Infineon Technologies AG Buffer/Inverter Based Peripheral Driver, 10A, MOS, PDSO8, GREEN, PLASTIC, SO-8
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code SOIC
Package Description DSO-8
Pin Count 8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 18 Weeks, 4 Days
Samacsys Manufacturer Infineon
Additional Feature ESD Value for IN pin is 1C
Adjustable Threshold NO
Analog IC - Other Type LOAD SWITCH
JESD-30 Code R-PDSO-G8
JESD-609 Code e3
Length 5 mm
Moisture Sensitivity Level 3
Number of Channels 1
Number of Functions 1
Number of Terminals 8
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Supply Current-Max (Isup) 1.3 mA
Supply Voltage-Max (Vsup) 34 V
Supply Voltage-Min (Vsup) 5 V
Supply Voltage-Nom (Vsup) 13.5 V
Surface Mount YES
Technology SIPMOS
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 4 mm

BSP762TXUMA1 Related Parts

BSP762TXUMA1 Frequently Asked Questions (FAQ)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.

  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple to monitor the device temperature.

  • The maximum allowed voltage on the input pins is 5.5V, exceeding this may cause damage to the device. Ensure that the input voltage is within the recommended operating range.

  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.

  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a cooling rate of 4-6°C/s. Ensure that the soldering process is within the recommended specifications to prevent damage to the device.

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