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Drivers And Interfaces / Peripheral Drivers / BTT62001EJAXUMA1
Datasheets
BTT62001EJAXUMA1 by: Infineon Technologies AG

Buffer/Inverter Based Peripheral Driver, 1A, PDSO8, DSO-8

Part Details for BTT62001EJAXUMA1 by Infineon Technologies AG

Results Overview of BTT62001EJAXUMA1 by Infineon Technologies AG

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Applications Education and Research Aerospace and Defense Agriculture Technology Robotics and Drones

BTT62001EJAXUMA1 Information

BTT62001EJAXUMA1 by Infineon Technologies AG is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Part Details for BTT62001EJAXUMA1

BTT62001EJAXUMA1 CAD Models

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BTT62001EJAXUMA1 Part Data Attributes

Parametric Data
BTT62001EJAXUMA1 Infineon Technologies AG
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BTT62001EJAXUMA1 Infineon Technologies AG Buffer/Inverter Based Peripheral Driver, 1A, PDSO8, DSO-8
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description DSO-8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Infineon
Adjustable Threshold NO
Analog IC - Other Type LOAD SWITCH
JESD-30 Code R-PDSO-G8
Length 4.9 mm
Number of Channels 1
Number of Functions 1
Number of Terminals 8
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HLSOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Screening Level AEC-Q100
Seated Height-Max 1.7 mm
Supply Current-Max (Isup) 4 mA
Supply Voltage-Max (Vsup) 48 V
Supply Voltage-Min (Vsup) 5 V
Supply Voltage-Nom (Vsup) 28 V
Surface Mount YES
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Width 3.9 mm

BTT62001EJAXUMA1 Frequently Asked Questions (FAQ)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure good thermal conductivity. A minimum of 5 thermal vias with a diameter of 0.3 mm is recommended.

  • To ensure EMC, Infineon recommends using a shielded cable and a common-mode choke to reduce electromagnetic interference (EMI). Additionally, a decoupling capacitor should be placed close to the device to filter out high-frequency noise.

  • The maximum allowed voltage on the VCC pin is 5.5 V. Exceeding this voltage may damage the device.

  • Infineon recommends using a soldering iron with a temperature of 260°C (max) and a soldering time of 3 seconds (max) to prevent damage to the device. For rework, a hot air gun with a temperature of 220°C (max) and an air flow rate of 20 L/min (max) is recommended.

  • Infineon recommends storing the device in a dry, cool place with a temperature range of -40°C to 125°C and a relative humidity of 60% (max).

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