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SimpleLink™ Wi-Fi CERTIFIED™ network processor module for Internet-of-Things with 2 TLS/SSL 63-QFM -20 to 70
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CC3100MODR11MAMOBR by Texas Instruments is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
3009761
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Farnell | WI-FI MODULE, INTERNET OF THINGS, 2.4GHZ RoHS: Compliant Min Qty: 1 Lead time: 40 Weeks, 1 Days Container: Cut Tape | 103 |
|
$13.0249 / $23.3615 | Buy Now |
|
LCSC | QFM-63 WiFi Modules ROHS | 10 |
|
$17.9671 / $21.2084 | Buy Now |
|
Win Source Electronics | IC RF TXRX+MCU WIFI 63SMD / CC3100MOD SimpleLink™ Certified Wi-Fi® Network Processor Internet-of-Things Module Solution for MCU Applications | 4570 |
|
$9.2857 / $13.9285 | Buy Now |
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CC3100MODR11MAMOBR
Texas Instruments
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Datasheet
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CC3100MODR11MAMOBR
Texas Instruments
SimpleLink™ Wi-Fi CERTIFIED™ network processor module for Internet-of-Things with 2 TLS/SSL 63-QFM -20 to 70
|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | LGA-63 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Data Rate | 16000 Mbps | |
JESD-30 Code | R-PBGA-B63 | |
JESD-609 Code | e4 | |
Length | 20.5 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 63 | |
Number of Transceivers | 1 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.38 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Telecom IC Type | WIRELESS LAN CIRCUIT | |
Temperature Grade | OTHER | |
Terminal Finish | Nickel/Gold (Ni/Au) | |
Terminal Form | BUTT | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17.5 mm |