-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for CDCLVC1108PWR by Texas Instruments
Overview of CDCLVC1108PWR by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CDCLVC1108PWR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Bristol Electronics | 161 |
|
RFQ | ||
|
|
Win Source Electronics | 3.3 V and 2.5 V LVCMOS High-Performance Clock Buffer Family | 15800 |
|
$2.3675 / $3.5512 | Buy Now |
Part Details for CDCLVC1108PWR
CDCLVC1108PWR CAD Models
CDCLVC1108PWR Part Data Attributes
|
|
CDCLVC1108PWR
Texas Instruments
Buy Now
Datasheet
|
Compare Parts:
CDCLVC1108PWR
Texas Instruments
Low jitter, 1:8 LVCMOS fan-out clock buffer 16-TSSOP -40 to 85
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP-16 | |
| Pin Count | 16 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Family | CDC | |
| Input Conditioning | STANDARD | |
| JESD-30 Code | R-PDSO-G16 | |
| JESD-609 Code | e4 | |
| Length | 5 mm | |
| Logic IC Type | LOW SKEW CLOCK DRIVER | |
| Max I(ol) | 0.012 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Inverted Outputs | ||
| Number of Terminals | 16 | |
| Number of True Outputs | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP16,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 2 ns | |
| Propagation Delay (tpd) | 2.6 ns | |
| Qualification Status | Not Qualified | |
| Same Edge Skew-Max (tskwd) | 0.05 ns | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4.4 mm | |
| fmax-Min | 250 MHz |