There are no models available for this part yet.
Overview of CY8C6145LQI-S3F72 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 5 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for CY8C6145LQI-S3F72 by Infineon Technologies AG
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
88AH5664
|
Newark | Psoc6/Tray Rohs Compliant: Yes |Infineon CY8C6145LQI-S3F72 RoHS: Compliant Min Qty: 1300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | ||
DISTI #
448-CY8C6145LQI-S3F72-ND
|
DigiKey | IC MCU 32BIT 512KB FLASH 68QFN Min Qty: 1300 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
|
$4.7935 | Buy Now | |
DISTI #
727-C6145LQI-S3F72
|
Mouser Electronics | ARM Microcontrollers - MCU U RoHS: Compliant | 500 |
|
$4.6700 / $8.2200 | Buy Now | |
Future Electronics | RoHS: Compliant pbFree: No Min Qty: 1300 Package Multiple: 1300 Lead time: 10 Weeks | 0 |
|
$4.2800 | Buy Now | ||
DISTI #
SP005658417
|
EBV Elektronik | (Alt: SP005658417) RoHS: Compliant Min Qty: 1300 Package Multiple: 1300 Lead time: 11 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for CY8C6145LQI-S3F72 by Infineon Technologies AG
Part Data Attributes for CY8C6145LQI-S3F72 by Infineon Technologies AG
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
Reach Compliance Code
|
compliant
|
JESD-30 Code
|
S-XQCC-N68
|
JESD-609 Code
|
e3
|
Length
|
8 mm
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
68
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
UNSPECIFIED
|
Package Code
|
HVQCCN
|
Package Equivalence Code
|
LCC68,.32SQ,16
|
Package Shape
|
SQUARE
|
Package Style
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Seated Height-Max
|
1 mm
|
Supply Voltage-Max
|
3.6 V
|
Supply Voltage-Min
|
1.7 V
|
Supply Voltage-Nom
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Pure Tin (Sn)
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
0.4 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
8 mm
|
uPs/uCs/Peripheral ICs Type
|
PROGRAMMABLE SoC
|