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Multifunction Peripheral,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-CY8C6347FMI-BLD13TCT-ND
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DigiKey | IC MCU 32BIT 1MB FLASH 104WLCSP Min Qty: 1 Lead time: 13 Weeks Container: Cut Tape (CT), Tape & Reel (TR), Digi-Reel® | Temporarily Out of Stock |
|
$7.7105 / $12.1700 | Buy Now |
DISTI #
CY8C6347FMI-BLD13T
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Avnet Americas | Microcontroller 32-Bit PSoC 63 ARM Cortex-M4F RISC 1024KB Flash 104-Pin MCSP T/R - Tape and Reel (Alt: CY8C6347FMI-BLD13T) RoHS: Compliant Min Qty: 1700 Package Multiple: 1700 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
|
$8.8970 | Buy Now |
DISTI #
727-CY8C6347FMIBD13T
|
Mouser Electronics | ARM Microcontrollers - MCU PSOC6 USB, BLE, WiFi RoHS: Compliant | 0 |
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$7.7100 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1700 Package Multiple: 1700 Lead time: 13 Weeks Container: Reel | 0Reel |
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$6.7600 | Buy Now |
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Rochester Electronics | CY8C6347FMI-BLD13T - PSoC6 RoHS: Not Compliant Status: Active Min Qty: 1 | 1314 |
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$7.1200 / $8.3700 | Buy Now |
DISTI #
SP005661657
|
EBV Elektronik | (Alt: SP005661657) RoHS: Compliant Min Qty: 1700 Package Multiple: 1700 Lead time: 14 Weeks, 0 Days | EBV - 0 |
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Buy Now |
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CY8C6347FMI-BLD13T
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY8C6347FMI-BLD13T
Infineon Technologies AG
Multifunction Peripheral,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | Infineon | |
JESD-30 Code | R-PBGA-B104 | |
JESD-609 Code | e1 | |
Length | 5 mm | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 104 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA104,9X14,14 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 0.65 mm | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.35 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 3.841 mm | |
uPs/uCs/Peripheral ICs Type | Bluetooth SoC |