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Overview of CYNSE70128-066 by Cypress Semiconductor
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for CYNSE70128-066 by Cypress Semiconductor
Part Data Attributes for CYNSE70128-066 by Cypress Semiconductor
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
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Part Package Code
|
BGA
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Package Description
|
BGA-388
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Pin Count
|
388
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.39.00.01
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JESD-30 Code
|
S-PBGA-B388
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JESD-609 Code
|
e0
|
Length
|
35 mm
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
388
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Package Body Material
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PLASTIC/EPOXY
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Package Code
|
BGA
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Package Equivalence Code
|
BGA388,26X26,50
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Package Shape
|
SQUARE
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Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
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Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.46 mm
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Supply Voltage-Nom
|
1.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Telecom IC Type
|
TELECOM CIRCUIT
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
35 mm
|