There are no models available for this part yet.
Overview of CYP15G0403DXB-BGXC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 3 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
CAD Models for CYP15G0403DXB-BGXC by Cypress Semiconductor
Part Data Attributes for CYP15G0403DXB-BGXC by Cypress Semiconductor
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
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|
Part Package Code
|
BGA
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|
Package Description
|
BGA-256
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|
Pin Count
|
256
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
5A991.B.1
|
|
HTS Code
|
8542.39.00.01
|
|
Data Rate
|
1500000 Mbps
|
|
JESD-30 Code
|
S-PBGA-B256
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|
JESD-609 Code
|
e1
|
|
Length
|
27 mm
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|
Moisture Sensitivity Level
|
3
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Number of Functions
|
1
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Number of Terminals
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256
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Number of Transceivers
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4
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
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|
|
Package Body Material
|
PLASTIC/EPOXY
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|
Package Code
|
HBGA
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|
Package Equivalence Code
|
BGA256,20X20,50
|
|
Package Shape
|
SQUARE
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|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.745 mm
|
|
Supply Current-Max
|
1.32 mA
|
|
Supply Voltage-Nom
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
BICMOS
|
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Telecom IC Type
|
ETHERNET TRANSCEIVER
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
|
Width
|
27 mm
|
Alternate Parts for CYP15G0403DXB-BGXC
This table gives cross-reference parts and alternative options found for CYP15G0403DXB-BGXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CYP15G0403DXB-BGXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CYP15G0403DXB-BGC | Telecom Circuit, 1-Func, BICMOS, PBGA256, 27 X 27 MM, 1.57 MM HEIGHT, BGA-256 | Cypress Semiconductor | CYP15G0403DXB-BGXC vs CYP15G0403DXB-BGC |
| CYP15G0403DX-BGC | Telecom Circuit, 1-Func, BICMOS, PBGA256, 27 X 27 MM, 2.33 MM HEIGHT, THERMALLY ENHANCED, PLASTIC, BGA-256 | Cypress Semiconductor | CYP15G0403DXB-BGXC vs CYP15G0403DX-BGC |
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