Part Details for CYP32G0401DX-BGC by Cypress Semiconductor
Overview of CYP32G0401DX-BGC by Cypress Semiconductor
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for CYP32G0401DX-BGC
CYP32G0401DX-BGC CAD Models
CYP32G0401DX-BGC Part Data Attributes
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CYP32G0401DX-BGC
Cypress Semiconductor
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Datasheet
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CYP32G0401DX-BGC
Cypress Semiconductor
Telecom Circuit, 1-Func, PBGA256, 27 X 27 MM, 1.57 MM HEIGHT, THERMALLY ENHANCED, BGA-256
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1.57 MM HEIGHT, THERMALLY ENHANCED, BGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Data Rate | 3125000 Mbps | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 256 | |
Number of Transceivers | 4 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,20X20,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.745 mm | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm |