Findchips: dlp9500bfln details by Texas Instruments

Results Overview of DLP9500BFLN by Texas Instruments

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Applications Consumer Electronics Audio and Video Systems Energy and Power Systems Medical Imaging

Part Details for DLP9500BFLN

Show differences only	DLP9500BFLN Texas Instruments Buy Now Datasheet	Buy Now	Compare Parts: DLP9500BFLN Texas Instruments 0.95-inch 1080p DLP® digital micromirror device (DMD) 355-CLGA 20 to 70

Pbfree Code	Yes
Rohs Code	Yes
Part Life Cycle Code	Active
Ihs Manufacturer	TEXAS INSTRUMENTS INC
Package Description	BGA,
Reach Compliance Code	compliant
ECCN Code	EAR99
HTS Code	8542.39.00.01
Consumer IC Type	CONSUMER CIRCUIT
JESD-30 Code	S-CBGA-B355
JESD-609 Code	e4
Length	42.16 mm
Number of Functions	1
Number of Terminals	355
Operating Temperature-Max	70 °C
Operating Temperature-Min	20 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA
Package Shape	SQUARE
Package Style	GRID ARRAY
Seated Height-Max	4.07 mm
Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	3 V
Surface Mount	YES
Temperature Grade	OTHER
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	BALL
Terminal Position	BOTTOM
Width	42.16 mm

Texas Instruments provides a recommended PCB layout and thermal management guide in the DLP9500BFLN evaluation module documentation. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
TI provides a Micromirror Array Optimization Guide that helps you optimize the micromirror array for your specific application. You can also consult with TI's technical support team for customized guidance.
The recommended power-up sequence is: 1) Power up the analog power supply (VANA), 2) Power up the digital power supply (VDIG), and 3) Initialize the DLPC350. The power-down sequence is the reverse of this order. Refer to the datasheet for more details.
Implement a robust power supply design, ensure proper thermal management, and follow TI's recommended operating conditions and guidelines for temperature and voltage variations. Additionally, consider implementing error detection and correction mechanisms in your system design.
Key considerations include: 1) Optical design and alignment, 2) Illumination system design, 3) Micromirror array optimization, 4) Thermal management, and 5) System calibration and testing. Consult with TI's technical support team and refer to the datasheet and application notes for more information.