Part Details for DS31412 by Rochester Electronics LLC
Overview of DS31412 by Rochester Electronics LLC
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Part Details for DS31412
DS31412 CAD Models
DS31412 Part Data Attributes
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DS31412
Rochester Electronics LLC
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Datasheet
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DS31412
Rochester Electronics LLC
DATACOM, FRAMER, PBGA349, 27 X 27 MM, BGA-349
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS INC | |
| Part Package Code | BGA | |
| Package Description | HBGA, | |
| Pin Count | 349 | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B349 | |
| JESD-609 Code | e0 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | NOT SPECIFIED | |
| Number of Functions | 1 | |
| Number of Terminals | 349 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 2.35 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | FRAMER | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27 mm |