Part Details for ECE1117-Y3-1-TR by Microchip Technology Inc
Overview of ECE1117-Y3-1-TR by Microchip Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for ECE1117-Y3-1-TR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
ECE1117-Y3-1-TR
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EBV Elektronik | Multi-Function BC-LinkTM/SMBus Companion Device (Alt: ECE1117-Y3-1-TR) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 11 Weeks, 0 Days | EBV - 0 |
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Part Details for ECE1117-Y3-1-TR
ECE1117-Y3-1-TR CAD Models
ECE1117-Y3-1-TR Part Data Attributes
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ECE1117-Y3-1-TR
Microchip Technology Inc
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Datasheet
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ECE1117-Y3-1-TR
Microchip Technology Inc
SPECIALTY MICROPROCESSOR CIRCUIT
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | HVQCCN, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-XQCC-N48 | |
| JESD-609 Code | e3 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max | 3.63 V | |
| Supply Voltage-Min | 2.97 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |