Part Details for ECF440AACCN-P4-Y3 by Micron Technology Inc
Overview of ECF440AACCN-P4-Y3 by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Not Available)
- Reference Designs: (Not Available)
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Price & Stock for ECF440AACCN-P4-Y3
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
ECF440AACCN-P4-Y3
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Avnet Americas | LPDDR3 4G DIE 128MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF440AACCN-P4-Y3) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 18 Weeks, 0 Days Container: Waffle Pack | 0 |
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RFQ | |
DISTI #
ECF440AACCN-P4-Y3
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Avnet Silica | (Alt: ECF440AACCN-P4-Y3) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks, 0 Days | Silica - 0 |
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