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Switching Regulator, Voltage-mode, 3A, 2300kHz Switching Freq-Max, 7 X 4 MM, 1.85 MM HEIGHT, ROHS COMPLIANT, QFN-38
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
EN6337QI by Intel Corporation is a Switching Regulator or Controller.
Switching Regulator or Controllers are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
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EN6337QI
Intel Corporation
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Datasheet
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EN6337QI
Intel Corporation
Switching Regulator, Voltage-mode, 3A, 2300kHz Switching Freq-Max, 7 X 4 MM, 1.85 MM HEIGHT, ROHS COMPLIANT, QFN-38
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Package Description | QFN-38 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Additional Feature | OPERATES IN ADJUSTABLE MODE FROM 0.6V TO 6.285V | |
Analog IC - Other Type | SWITCHING REGULATOR | |
Control Mode | VOLTAGE-MODE | |
Control Technique | PULSE WIDTH MODULATION | |
Input Voltage-Max | 6.6 V | |
Input Voltage-Min | 2.5 V | |
Input Voltage-Nom | 5 V | |
JESD-30 Code | R-XQCC-N38 | |
JESD-609 Code | e3 | |
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 38 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Current-Max | 3 A | |
Package Body Material | UNSPECIFIED | |
Package Code | HQCCN | |
Package Equivalence Code | LCC38,.16X.28,20 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.9 mm | |
Surface Mount | YES | |
Switcher Configuration | BUCK | |
Switching Frequency-Max | 2300 kHz | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 4 mm |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
Power sequencing should follow the recommended sequence: VCC, VCCP, and VTT. Voltage ramp-up should be controlled to avoid overshoot and ensure a monotonic rise.
Implement power gating, dynamic voltage and frequency scaling, and optimize the clock tree. Use the device's built-in power management features and consider using a low-power mode.
Use a multi-layer PCB with a solid ground plane, implement good signal routing practices, and consider using shielding and filtering components. Ensure proper decoupling and bypassing of power supplies.