Datasheets
EN6337QI by:

Switching Regulator, Voltage-mode, 3A, 2300kHz Switching Freq-Max, 7 X 4 MM, 1.85 MM HEIGHT, ROHS COMPLIANT, QFN-38

Part Details for EN6337QI by Intel Corporation

Results Overview of EN6337QI by Intel Corporation

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EN6337QI Information

EN6337QI by Intel Corporation is a Switching Regulator or Controller.
Switching Regulator or Controllers are under the broader part category of Power Circuits.

A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.

Part Details for EN6337QI

EN6337QI CAD Models

EN6337QI Part Data Attributes

EN6337QI Intel Corporation
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EN6337QI Intel Corporation Switching Regulator, Voltage-mode, 3A, 2300kHz Switching Freq-Max, 7 X 4 MM, 1.85 MM HEIGHT, ROHS COMPLIANT, QFN-38
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Package Description QFN-38
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature OPERATES IN ADJUSTABLE MODE FROM 0.6V TO 6.285V
Analog IC - Other Type SWITCHING REGULATOR
Control Mode VOLTAGE-MODE
Control Technique PULSE WIDTH MODULATION
Input Voltage-Max 6.6 V
Input Voltage-Min 2.5 V
Input Voltage-Nom 5 V
JESD-30 Code R-XQCC-N38
JESD-609 Code e3
Length 7 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 38
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Current-Max 3 A
Package Body Material UNSPECIFIED
Package Code HQCCN
Package Equivalence Code LCC38,.16X.28,20
Package Shape RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.9 mm
Surface Mount YES
Switcher Configuration BUCK
Switching Frequency-Max 2300 kHz
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm

EN6337QI Related Parts

EN6337QI Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.

  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.

  • Power sequencing should follow the recommended sequence: VCC, VCCP, and VTT. Voltage ramp-up should be controlled to avoid overshoot and ensure a monotonic rise.

  • Implement power gating, dynamic voltage and frequency scaling, and optimize the clock tree. Use the device's built-in power management features and consider using a low-power mode.

  • Use a multi-layer PCB with a solid ground plane, implement good signal routing practices, and consider using shielding and filtering components. Ensure proper decoupling and bypassing of power supplies.

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