Datasheets
EP2AGX125DF25C4G by:

Field Programmable Gate Array, 118143-Cell, PBGA572, FBGA-572

Part Details for EP2AGX125DF25C4G by Intel Corporation

Overview of EP2AGX125DF25C4G by Intel Corporation

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Financial Technology (Fintech) Computing and Data Storage Smart Cities Aerospace and Defense Telecommunications Communication and Networking Automotive

Price & Stock for EP2AGX125DF25C4G

Part # Distributor Description Stock Price Buy
DISTI # EP2AGX125DF25C4G-ND
DigiKey IC FPGA 260 I/O 572FBGA Min Qty: 44 Lead time: 26 Weeks Container: Tray Temporarily Out of Stock
  • 44 $2,167.7016
$2,167.7016 Buy Now

Part Details for EP2AGX125DF25C4G

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EP2AGX125DF25C4G Part Data Attributes

EP2AGX125DF25C4G Intel Corporation
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EP2AGX125DF25C4G Intel Corporation Field Programmable Gate Array, 118143-Cell, PBGA572, FBGA-572
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description FBGA-572
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B572
Length 25 mm
Number of CLBs 4964
Number of Inputs 260
Number of Logic Cells 118143
Number of Outputs 260
Number of Terminals 572
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4964 CLBS
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA572,24X24,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.15 mm
Supply Voltage-Max 0.93 V
Supply Voltage-Min 0.87 V
Supply Voltage-Nom 0.9 V
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 25 mm

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