Part Details for EP2AGX260FF35C6G by Intel Corporation
Overview of EP2AGX260FF35C6G by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Security and Surveillance
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Price & Stock for EP2AGX260FF35C6G
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
EP2AGX260FF35C6G-ND
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DigiKey | IC FPGA 612 I/O 1152FBGA Min Qty: 24 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$3,278.8946 | Buy Now |
Part Details for EP2AGX260FF35C6G
EP2AGX260FF35C6G CAD Models
EP2AGX260FF35C6G Part Data Attributes
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EP2AGX260FF35C6G
Intel Corporation
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Datasheet
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EP2AGX260FF35C6G
Intel Corporation
Field Programmable Gate Array, 244188-Cell, PBGA1152, FBGA-1152
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
JESD-30 Code | S-PBGA-B1152 | |
Length | 35 mm | |
Number of CLBs | 10260 | |
Number of Inputs | 612 | |
Number of Logic Cells | 244188 | |
Number of Outputs | 612 | |
Number of Terminals | 1152 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 10260 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 2.55 mm | |
Supply Voltage-Max | 0.93 V | |
Supply Voltage-Min | 0.87 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm |