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Programmable Logic Field Programmable Gate Arrays EP2SGX30DF780C4N

EP2SGX30DF780C4N
Description: Field Programmable Gate Array, 33880 CLBs, 717MHz, 33880-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780

Overview of EP2SGX30DF780C4N by Intel Corporation

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  • Distributor Offerings: ( 2 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 0 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Education and Research Consumer Electronics Internet of Things (IoT) Industrial Automation Computing and Data Storage Financial Technology (Fintech) Aerospace and Defense Smart Cities Telecommunications Electronic Manufacturing Communication and Networking Automotive

Price & Stock for EP2SGX30DF780C4N by Intel Corporation

Part # Manufacturer Description Stock Price Buy
DISTI # EP2SGX30DF780C4N
Avnet Americas FPGA Stratix II GX Family 33880 Cells 732.1MHz 1.2V 780-Pin FC-FBGA - Trays (Alt: EP2SGX30DF780C4N) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray 8 Partner Stock
  • 1 $570.2200
  • 25 $532.2000
  • 25 $558.8100
  • 100 $510.4800
  • 1,000 $461.6000
$461.6000 / $570.2200 Buy Now
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:1-2weeks 0 Stock,170 Available
  • 1 $1,319.2700
  • 5 $1,225.6500
  • 10 $1,132.0200
  • 24 $1,038.3900
$1,038.3900 / $1,319.2700 RFQ

CAD Models for EP2SGX30DF780C4N by Intel Corporation
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Part Data Attributes for EP2SGX30DF780C4N by Intel Corporation
Parametric Data

EP2SGX30DF780C4N
Intel Corporation
Buy Now
-
-
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEL CORP
Package Description
29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780
Reach Compliance Code
compliant
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Clock Frequency-Max
717 MHz
Combinatorial Delay of a CLB-Max
5.117 ns
JESD-30 Code
S-PBGA-B780
JESD-609 Code
e1
Length
29 mm
Moisture Sensitivity Level
3
Number of CLBs
33880
Number of Inputs
361
Number of Logic Cells
33880
Number of Outputs
361
Number of Terminals
780
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
33880 CLBS
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA780,28X28,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
3.5 mm
Supply Voltage-Max
1.25 V
Supply Voltage-Min
1.15 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
29 mm
Want to compare parts?
  1. EP2SGX30DF780C4N
    Intel Corporation
    Field Programmable Gate Array, 33880 CLBs, 717MHz, 33880-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780
    VS

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