There are no models available for this part yet.
Overview of EPF10K100ABI356-3 by Intel Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 5 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
CAD Models for EPF10K100ABI356-3 by Intel Corporation
Part Data Attributes for EPF10K100ABI356-3 by Intel Corporation
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
INTEL CORP
|
Package Description
|
LBGA, BGA356,26X26,50
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.D
|
HTS Code
|
8542.39.00.01
|
Samacsys Manufacturer
|
Intel
|
JESD-30 Code
|
S-PBGA-B356
|
JESD-609 Code
|
e0
|
Length
|
35 mm
|
Moisture Sensitivity Level
|
3
|
Number of Dedicated Inputs
|
4
|
Number of I/O Lines
|
274
|
Number of Inputs
|
274
|
Number of Logic Cells
|
4992
|
Number of Outputs
|
274
|
Number of Terminals
|
356
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
4 DEDICATED INPUTS, 274 I/O
|
Output Function
|
REGISTERED
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA356,26X26,50
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel)
|
220
|
Programmable Logic Type
|
LOADABLE PLD
|
Propagation Delay
|
0.8 ns
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.63 mm
|
Supply Voltage-Max
|
3.6 V
|
Supply Voltage-Min
|
3 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN/LEAD (SN63PB37)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
35 mm
|
Alternate Parts for EPF10K100ABI356-3
This table gives cross-reference parts and alternative options found for EPF10K100ABI356-3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPF10K100ABI356-3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
EPF10K100ABI356-3 | Loadable PLD, 0.8ns, CMOS, PBGA356, BGA-356 | Altera Corporation | EPF10K100ABI356-3 vs EPF10K100ABI356-3 |
EPF10K100ABC356-3 | Loadable PLD, 0.8ns, CMOS, PBGA356, BGA-356 | Intel Corporation | EPF10K100ABI356-3 vs EPF10K100ABC356-3 |
EPF10K100ABC356-3N | Loadable PLD, 0.8ns, CMOS, PBGA356, BGA-356 | Intel Corporation | EPF10K100ABI356-3 vs EPF10K100ABC356-3N |
EPF10K100ABI356-3N | Loadable PLD, 0.8ns, CMOS, PBGA356, BGA-356 | Intel Corporation | EPF10K100ABI356-3 vs EPF10K100ABI356-3N |
EPF10K100ABC356-3 | Loadable PLD, 0.8ns, CMOS, PBGA356, BGA-356 | Altera Corporation | EPF10K100ABI356-3 vs EPF10K100ABC356-3 |
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