Part Details for EPF10K200SFC672-2 by Intel Corporation
Overview of EPF10K200SFC672-2 by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for EPF10K200SFC672-2
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
EPF10K200SFC672-2
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Avnet Americas | FPGA FLEX 10KE Family 200K Gates 9984 Cells 200MHz CMOS Technology 2.5V 672-Pin FBGA - Trays (Alt: EPF10K200SFC672-2) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 428 Partner Stock |
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$462.6800 / $571.5500 | Buy Now |
Part Details for EPF10K200SFC672-2
EPF10K200SFC672-2 CAD Models
EPF10K200SFC672-2 Part Data Attributes
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EPF10K200SFC672-2
Intel Corporation
Buy Now
Datasheet
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Compare Parts:
EPF10K200SFC672-2
Intel Corporation
Loadable PLD, 0.6ns, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 4 Weeks | |
JESD-30 Code | S-PBGA-B672 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 470 | |
Number of Inputs | 470 | |
Number of Logic Cells | 9984 | |
Number of Outputs | 470 | |
Number of Terminals | 672 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 470 I/O | |
Output Function | MIXED | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Programmable Logic Type | LOADABLE PLD | |
Propagation Delay | 0.6 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.1 mm | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm |
Alternate Parts for EPF10K200SFC672-2
This table gives cross-reference parts and alternative options found for EPF10K200SFC672-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPF10K200SFC672-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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EPF10K200SFC672-2X | Loadable PLD, 0.6ns, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | Altera Corporation | EPF10K200SFC672-2 vs EPF10K200SFC672-2X |
EPF10K200SFC672-2 | Loadable PLD, 0.6ns, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | Altera Corporation | EPF10K200SFC672-2 vs EPF10K200SFC672-2 |
EPF10K200SFC672-2N | Loadable PLD, 0.6ns, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | Intel Corporation | EPF10K200SFC672-2 vs EPF10K200SFC672-2N |
EPF10K200SFI672-2 | Loadable PLD, 0.6ns, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | Altera Corporation | EPF10K200SFC672-2 vs EPF10K200SFI672-2 |
EPF10K200SFI672-2N | Loadable PLD, 0.6ns, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | Altera Corporation | EPF10K200SFC672-2 vs EPF10K200SFI672-2N |
EPF10K200SFC672-2N | Loadable PLD, 0.6ns, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | Altera Corporation | EPF10K200SFC672-2 vs EPF10K200SFC672-2N |