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Overview of FAN2108EMPX by Fairchild Semiconductor Corporation
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
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CAD Models for FAN2108EMPX by Fairchild Semiconductor Corporation
Part Data Attributes for FAN2108EMPX by Fairchild Semiconductor Corporation
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code
|
MLP
|
Package Description
|
5 X 6 MM, GREEN, MO-220WJHC, MLP-25
|
Pin Count
|
25
|
Manufacturer Package Code
|
25LD,MLP,QUAD,NON-JEDEC,6X5MM,TRIPLE DAP
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.31.00.01
|
Additional Feature
|
ALSO OPERATES IN ADJUSTABLE MODE FROM 0.8V TO 19.2V
|
Analog IC - Other Type
|
SWITCHING REGULATOR
|
Control Mode
|
CURRENT-MODE
|
Control Technique
|
PULSE WIDTH MODULATION
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Input Voltage-Max
|
24 V
|
Input Voltage-Min
|
3 V
|
JESD-30 Code
|
R-XQCC-N25
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JESD-609 Code
|
e4
|
Length
|
6 mm
|
Moisture Sensitivity Level
|
1
|
Number of Functions
|
1
|
Number of Terminals
|
25
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Output Current-Max
|
18 A
|
Package Body Material
|
UNSPECIFIED
|
Package Code
|
HVQCCN
|
Package Equivalence Code
|
LCC25/28,.2X.24,25
|
Package Shape
|
RECTANGULAR
|
Package Style
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CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
0.8 mm
|
Surface Mount
|
YES
|
Switcher Configuration
|
BUCK
|
Switching Frequency-Max
|
660 kHz
|
Technology
|
BICMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
0.65 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
5 mm
|
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