Part Details for FDC37N769 by SMSC
Overview of FDC37N769 by SMSC
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
Renewable Energy
Robotics and Drones
Price & Stock for FDC37N769
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 87 |
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RFQ |
Part Details for FDC37N769
FDC37N769 CAD Models
FDC37N769 Part Data Attributes
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FDC37N769
SMSC
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Datasheet
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FDC37N769
SMSC
Multifunction Peripheral, CMOS, PQFP100, TQFP-100
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STANDARD MICROSYSTEMS CORP | |
| Part Package Code | QFP | |
| Package Description | TQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO CONTAINS GAME PORT | |
| Address Bus Width | 11 | |
| Boundary Scan | NO | |
| Bus Compatibility | PC-XT; PC-AT; ISA; PS/2 | |
| Clock Frequency-Max | 14.318 MHz | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 8 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Current-Max | 20 mA | |
| Supply Voltage-Max | 3.63 V | |
| Supply Voltage-Min | 2.97 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |