Part Details for FDC37N972FBGA by SMSC
Overview of FDC37N972FBGA by SMSC
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Automotive
Price & Stock for FDC37N972FBGA
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
2156-FDC37N972FBGA-ND
|
DigiKey | ADVANCED NOTEBOOK I/O CONTROLLER Min Qty: 22 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
7695 In Stock |
|
$13.8700 | Buy Now |
|
|
Rochester Electronics | FDC37N972 - Advanced Notebook I/O Controller With Enhanced Keyboard Control And System Management ' RoHS: Not Compliant pbFree: No Status: Obsolete Min Qty: 1 | 7695 |
|
$11.9000 / $14.0000 | Buy Now |
Part Details for FDC37N972FBGA
FDC37N972FBGA CAD Models
FDC37N972FBGA Part Data Attributes:
|
|
FDC37N972FBGA
SMSC
Buy Now
Datasheet
|
Compare Parts:
FDC37N972FBGA
SMSC
Multifunction Peripheral, CMOS, PBGA208, 15 X 15 MM, 1.10 MM HEIGHT, FBGA-208
|
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STANDARD MICROSYSTEMS CORP | |
| Part Package Code | BGA | |
| Package Description | 15 X 15 MM, 1.10 MM HEIGHT, FBGA-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | 2.88MB SUPER I/O FLOPPY DISK CONTROLLER; KEY BOARD CONTROLLER | |
| Address Bus Width | 16 | |
| Boundary Scan | NO | |
| Bus Compatibility | PC-XT; PC-AT; ISA; PS/2 | |
| Clock Frequency-Max | 14.318 MHz | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PBGA-B208 | |
| Length | 15 mm | |
| Number of I/O Lines | 50 | |
| Number of Terminals | 208 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| RAM (words) | 256 | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max | 3.45 V | |
| Supply Voltage-Min | 3.15 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |