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N-Channel PowerTrench® MOSFET 30V, 267A, 0.99mΩ, PQFN-8, 3000-REEL
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
FDMS7650 by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
55T6323
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Newark | Mosfet Transistor, N Channel, 60 A, 30 V, 0.0008 Ohm, 10 V, 1.9 V Rohs Compliant: Yes |Onsemi FDMS7650 RoHS: Compliant Min Qty: 5 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 4634 |
|
$1.5200 / $2.5500 | Buy Now |
DISTI #
64R3023
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Newark | Mosfet Transistor, Full Reel, Channel Type:N Channel, Drain Source Voltage Vds:30V, Continuous Drain Current Id:60A, Transistor Mounting:Surface Mount, Rds(On) Test Voltage:10V, Gate Source Threshold Voltage Max:1.9V, Product Range:-Rohs Compliant: Yes |Onsemi FDMS7650 RoHS: Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
$1.4400 | Buy Now |
DISTI #
FDMS7650
|
Avnet Americas | Trans MOSFET N-CH 30V 36A 8-Pin Power 56 T/R - Tape and Reel (Alt: FDMS7650) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 24 Weeks, 0 Days Container: Reel | 0 |
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$1.2288 / $1.2544 | Buy Now |
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Bristol Electronics | 400 |
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RFQ | ||
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Rochester Electronics | Power Field-Effect Transistor, 36A, 30V, 0.99ohm, N-Channel, MOSFET RoHS: Not Compliant Status: Active Min Qty: 1 | 2124 |
|
$1.1400 / $1.4300 | Buy Now |
DISTI #
FDMS7650
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Richardson RFPD | POWER MOSFET TRANSISTOR RoHS: Compliant Min Qty: 3000 | 0 |
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$1.0600 | Buy Now |
DISTI #
FDMS7650
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Avnet Asia | Trans MOSFET N-CH 30V 36A 8-Pin Power 56 T/R (Alt: FDMS7650) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 24 Weeks, 0 Days | 0 |
|
$1.3049 / $1.4594 | Buy Now |
DISTI #
FDMS7650
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Avnet Silica | Trans MOSFET NCH 30V 36A 8Pin Power 56 TR (Alt: FDMS7650) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 25 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
FDMS7650
|
EBV Elektronik | Trans MOSFET NCH 30V 36A 8Pin Power 56 TR (Alt: FDMS7650) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 26 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
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FDMS7650
onsemi
Buy Now
Datasheet
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Compare Parts:
FDMS7650
onsemi
N-Channel PowerTrench® MOSFET 30V, 267A, 0.99mΩ, PQFN-8, 3000-REEL
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | PQFN-8 | |
Package Description | ROHS COMPLIANT, POWER 56, 8 PIN | |
Manufacturer Package Code | 483AE | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
Factory Lead Time | 24 Weeks | |
Samacsys Manufacturer | onsemi | |
Avalanche Energy Rating (Eas) | 544 mJ | |
Case Connection | DRAIN | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 30 V | |
Drain Current-Max (ID) | 36 A | |
Drain-source On Resistance-Max | 0.99 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JESD-30 Code | R-PDSO-F5 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 5 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | N-CHANNEL | |
Power Dissipation-Max (Abs) | 104 W | |
Pulsed Drain Current-Max (IDM) | 450 A | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON |
A 4-layer PCB with a dedicated thermal layer and a thermal via array under the device is recommended. This layout helps to dissipate heat efficiently and reduces thermal resistance.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots. Monitor the device's junction temperature and adjust the system design accordingly.
Consider the heat sink's thermal resistance, material, and surface finish. A heat sink with a low thermal resistance (e.g., < 1°C/W) and a rough surface finish (e.g., black anodized) is recommended. Ensure the heat sink is compatible with the device's package and thermal interface material.
Use a gate drive circuit with a low output impedance and a fast rise/fall time (e.g., < 10 ns). Ensure the gate drive voltage is within the recommended range (e.g., 10-15 V). Use a gate resistor with a value between 10-50 ohms to optimize switching performance.
Use a common-mode choke and a differential-mode filter to reduce EMI. Implement a shielded enclosure and ensure good grounding practices. Keep sensitive components and cables away from the power stage. Use a layout that minimizes loop areas and reduces radiation.