Datasheets
FSX017X by:

RF Small Signal Field-Effect Transistor, 1-Element, X Band, Gallium Arsenide, N-Channel, High Electron Mobility FET, DIE-4

Part Details for FSX017X by SUMITOMO ELECTRIC Device Innovations Inc

Results Overview of FSX017X by SUMITOMO ELECTRIC Device Innovations Inc

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FSX017X Information

FSX017X by SUMITOMO ELECTRIC Device Innovations Inc is an RF Small Signal Field-Effect Transistor.
RF Small Signal Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Part Details for FSX017X

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FSX017X Part Data Attributes

FSX017X SUMITOMO ELECTRIC Device Innovations Inc
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FSX017X SUMITOMO ELECTRIC Device Innovations Inc RF Small Signal Field-Effect Transistor, 1-Element, X Band, Gallium Arsenide, N-Channel, High Electron Mobility FET, DIE-4
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer EUDYNA DEVICES INC
Part Package Code DIE
Package Description UNCASED CHIP, R-XUUC-N4
Pin Count 4
Reach Compliance Code unknown
ECCN Code EAR99
Additional Feature HIGH RELIABILITY
Configuration SINGLE
DS Breakdown Voltage-Min 12 V
FET Technology HIGH ELECTRON MOBILITY
Highest Frequency Band X BAND
JESD-30 Code R-XUUC-N4
Number of Elements 1
Number of Terminals 4
Operating Mode DEPLETION MODE
Package Body Material UNSPECIFIED
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type N-CHANNEL
Qualification Status Not Qualified
Surface Mount YES
Terminal Form NO LEAD
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application AMPLIFIER
Transistor Element Material GALLIUM ARSENIDE

FSX017X Related Parts

FSX017X Frequently Asked Questions (FAQ)

  • A multi-layer PCB with a dedicated ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. A thermal pad on the bottom of the device should be connected to a thermal plane or a heat sink.

  • Implement a robust power-on reset circuit, ensure a stable power supply, and consider using a thermistor or thermocouple to monitor temperature. Also, ensure that the device is properly soldered and the PCB is free from thermal stress.

  • Critical timing parameters include clock frequency, data setup and hold times, and signal rise and fall times. Ensure signal integrity by using controlled impedance traces, minimizing signal routing, and using signal termination resistors as needed.

  • Use ESD-protective packaging and handling procedures. Ensure that the device is handled in an ESD-protected environment, and use an ESD wrist strap or mat during assembly. Avoid touching the device pins or exposing them to static electricity.

  • Perform functional testing, including input/output signal verification, power consumption measurement, and temperature testing. Validate the device's performance using a test fixture or a custom-designed test board.

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